Molex has a contact array package (LGA) 1155 Intel® CPU socket assembly. LGA 1155 CPU socket is also known as Socket H2 socket designed for Intel (Intel), code-named Sandy Bridge second generation Core ™ i7 / i5 / i3 series desktop PC microprocessors. The circuit 1155 is the socket LGA 1156 (or Socket H1) for the Nehalem alternative socket.
Carol Liang Molex commercial products division product manager, said: "Intel's second generation Core microprocessors are used in 32 nm microarchitecture, delivering breakthrough performance .Molex use of interconnection engineering expertise to support this market-leading performance. we offer a rigorously tested, high reliability, precise design of the socket assembly, support for desktop PCs, servers and workstations, Intel Core i7 / i5 / i3 processor. "
LGA 1155 LGA 1156 and socket has a number of characteristics in common, such as 0.9144 mm (.036 inches) spacing, I / O, power for the processor and the mating ground contact, and with a 24 x 16 grid depopulated ( grid depopulaTIon) of 40 x 40 grid array, and the array of contacts arranged in two placed opposite the L form, in order to maintain electrical contact with the processor load conditions.
Further, both the receptacle used as a substrate of high strength copper alloy contact material, to ensure contact with their respective LGA package reliable physical contact, both sockets may be designed to withstand conditions typical reflow. At the bottom of the socket has two lead-free solder balls for surface mount motherboard. Separate crimping means (Independent Loading Mechanism, ILM) with two each with a common outlet, and the substrate is fixed by the PCB, to install the processor to provide the desired outlet pressure, and by the socket joints the pressure load generated uniformly distributed.
Due to differences in electrical, mechanical and key aspects is therefore not compatible with the socket LGA1155 and LGA1156 based processor is used. However, a similar three-piece two sockets (three-piece) jack designs are included, the ILM and the substrate, the socket from one generation to the next to ensure that the receptacle, the receptacle can be easily transferred useful features and advantages.
LGA 1155 socket assembly (47596-0232 and 47596-0233) Molex the latest release of the new LGA 1156 and extended product (47596-0532 and 47596-0533) provides a 15 and 30 micron gold plated contacts type models. The receptacle has a height of 2.10 mm (0.083 inch) general align key (alignment- key), in order to accommodate the optional pick and place ILM top lid.
Other new elements 47596 socket LGA 1155 series and added to LGA1156 shoulder screws and flat head, for 1U server. These elements each having a 5.60 mm (0.220 inches) and 4.22 mm (0.166 inch) thread size, and are lead. Technology area
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