E dismantles, love board network and Ewistech honor, take you to the world that smart electron dismantles. Knowing, knowing that it is, smart phone, intelligent wear, smart home is uncharacted! Want to see the professional dismantling analysis of the latest coolest products? Want to keep up with the latest technology pulse and market trend? Decomposition in e.
The smartphone has developed to present, technology innovation encounters bottlenecks, manufacturers can only be a fast charging, larger screen, ultra-narrow border, etc. when publishing new models. The newly entered LeTV mobile phone released three new mobile phones in the first half of the year, and it has played the slogan of "borderless". The boundless frame is not a new concept. Last year we analyze Sharp Crystal, a boundless smartphone that is implemented by refraction. Take a look at our domestic boundless mobile phone.
Le 1PRO is equipped with 64 high-pass Snapdragon 810 MSM8994 processor, RAM is 4GB, battery 3000 mA, 5.5 inch 2K display, 4 megapixel front camera plus 13 million optical anti-shake cameras, and equipped with two color temperature Flash. Obviously, the hardware configuration is high-end route.
Le 1PRO 1 uses one metal body, the back cover is integrally formed with the side of the fuselage, and can only start from the mobile phone screen on the disassembly. This is similar to the HTC ONE series.
Remove the SIM calork, fully heaten the screen, use the suction cup to draw the edge of the screen, draw along the screen along the screen with the fuselage, 1PRO is suspended screen technology, the edge of the entire screen with viscose Above the border of the thickness of 1.05 mm, after the seam is drawn, we can see that the display screen soft cable interface is fixed to the main board in the bodyboard in the bodyboard, and the fixed metal tablet is removed by screwdriver. The T4 screw is removed, and the metal table is removed, so that the 5.5-inch liquid crystal screen is separated from the body, and the remaining 17 fixed screws remaining in the body can be removed. Be
1PRO used a 5.5-inch custom display from Japan Sharp, with a resolution of 2560x1440. The pixel density reached 538dpi. The screen non-display area had a black edge width of 2.4 mm, and the screen model was confirmed as: LS055R1SX08, the entire display The three generations of Corning gorilla protects the glass, the glass thickness reaches 0.75 mm.
Le 1PRO uses full suspension technology to let the glass containing the black side of the glass micro-border surface, the convex screen does not have a box, LeTV said that his mobile phone is ID without border, ID refers to industrial design. In fact, from the perspective of the display, the black edge is still, obviously exists.
So the so-called boundless frame is just a text game. In the subsequent, the display of the display is found in the screen's display, and the conventional LCD screen is not distinguished, just protect the space on both sides of the glass to leave the space than a general display Slightly narrow, the side width of the measured reserved side is 1 mm.
After the upper left corner sensor is flexible, the support plate can be easily removed, and the handset on the top of the support plate can be removed. The support plate is made of a PC gum-mnemy aluminum alloy material. The upper and lower black portion is a PC material, and the interrupt is magnesium aluminum alloy. The front surface of the support plate has graphite stickers. The entire plate is fixed in the metal body, and supports the main board. Role. Be
1PRO adopted a 3.8V 3000 mA and polymer battery produced by Xinwangda Electronics Co., Ltd., and the battery model was LT55A using the LG battery, and the whole battery was fixed.
The volume control cable is attached to the metal fixture, secured to the side of the fuselage with two T4 screws.
Open the motherboard, open the wiring of the back link of the motherboard back to remove the motherboard, and remove the 13 million postal camera and the top of the optical distance sensor soft line. We can see that the motherboard is covered by the shield and has a heat dissipation sticker.
1PRO adopts the post-13 megapixel plus front 4 megapixel camera configuration solution, the 13 megapixel rear camera has been analyzed and confirmed by the Sony IMX214 photosensitive element. The camera is equipped with an INVENSESE's IDG-202 special image stable gyroscope. . The 4 megapixel front camera uses OV4688 BSI photosensitive components.
Continue to remove it down. Be
LeTV 1PRO first uses an elliptical Type-C-type USB2.0 interface in the Android phones.
Finally, let's take a look at the metal fuselage, 1PRO uses an aviation aluminum alloy material manufacturing one body, and the inside of the body is injection molded polycarbonate material, and the communication antenna of the whole machine. The edge of the fuselage is measured, and the thickness of the side step is 1.05 mm, and the inner thickness of the step is 0.8 mm to 1 mm, and a black viscose is sticked in the 1 mm step for the fixed screen. The thickness of the stairs is exactly the reserved width of both sides of the screen protected glass. The back side of the body uses an arcuate design similar to the edge of the HTC One M9
After opening the motherboard shield, we didn't discover a special chip program on 1pro. With other mobile phones using Qualcomm Snapdragon 810 MSM8999, it is basically consistent on the chip. LeTV official promotion 1PRO supports fast charging, but our engineers are on the motherboard. There is no discovery of high-pass high-pass high-pass high-pass SMB1357.
LeTV is soldered on the back of the motherboard on the back of the motherboard. The shield is filled with a white heat sink silicone cream in the shield. The shield of the processor is also attached to the shield of the processor.
There is a noise reduction microphone on top of the front of the motherboard. There is also a model microphone in the same position on the back of the motherboard. The front chip mainly includes high-pass WTR3925 radio frequency transceiver, WCD9330 audio decoding chip, AVAGO ACPM-7717 RF power amplifier and maxiM MAXQ616 infrared Remote control chip. The back of the motherboard includes: POP package Samsung 4GB system memory plus MSM8994 processor chipset, Samsung's KLMBG4GEND-B031 32GB flash memory, Qualcomm PMI89994, PM8994 power management chip, QCA6164 WiFi, Bluetooth, NFC chip, LeTV and ESS customized letv -HQ7A HIFI audio decoding chip.
Set map
Le 1PRO as one of the three mobile phones in the smartphone market, although the body of the curved design is the suspicion of imitation, it is still very good in the work and materials, although the assembly process of the whole machine is simple, but comparison Compact, late maintenance cost is not high.
The boundless frame concept used by LeTV, ewisetech dismantling the engineer's personal feeling is just a head, after all, it is visually able to see a non-display area with a width of 2.4 mm.
On the construction and stack of the whole machine, LeTV 1 Pro also has a certain strengthening with the latest technology and driving, heat dissipation, the use of Type-C type USB2.0 interface, integrated speaker, etc. can be embodied.
Our other product:
