Newly designed blackberry Z10 HD demolition map exposure

picture: Blackberry Z10 When you take the back cover and the bracket, you can see the motherboard, almost all chips and slots have electromagnetic shield coverage. Positive part of the PCB Positive part of the PCB Positive part of the PCB The front main chip is: - We should be beautiful (Invensense) ITG 3050 gyroscope - STMicroelectronics Accelerator - AVAGO ACPM-7051, Analog Devices 7803-K76P: Responsible for part of RF function - Samsung KLMAG2GE4A 16GB (2GB) flash memory, next to a microSD card slot - Guide to confirm PCB back full map PCB on the back of the PCB The back main chip is: - Gao Tong Snapdragon MSM8960 dual-core processor, with Samsung K3PE0E00DA 2GB memory package High Tong PM5921 Power Manager High-Tong RTR8600 Transceiver - Texas Instruments WL1287 Wi-Fi / Bluetooth / FM / GPS Wireless Chip (WiLink 7.0): BoTong BCM43XX series may exceed 80% in Wi-Fisoc field, but Deyi is a 40nm process, but also integrates Bo Tong No GPS. - TriQuint AC8358 front end RF chip - Fujitsu Milbeaut MBG0645C Image Sensor: This thing does not have there, but it is extremely rare. It is handled separately from HD video, and the main processor can alleviate some burden and better run applications. - SecureAd NFC chip: It is very strange. At present, the most commonly used NXP PN544, single-chip, and this is a multi-chip package, the size is also a large, may it be lower? High-pass processor with Samsung memory Image sensing Camera NFC chip Come with a slightly handle: The following video 喽: (want to know more, come see 哟)

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