PlayBook LTE demonstrates the continued growth of Qualcomm and the relationship between RIM and TI.
When PlayBook LTE is dismantled, it is clear that RIM does not change much in the choice of semiconductor cooperatives and the original version of Playbook selected. Maintaining a key socket in the new Playbook is TI. Playbook LET uses Ti's OMAP 4460, which is an upgrade version of OMAP4430 in the initial version of Playbook. The main difference between the two processors is that the OMAP4460 increases the clock frequency to 1.0 GHz instead of the 4430 1.0GHz, and the 4460 has a better 3D video processing function. Like their former, OMAP4460 is a dual-core processor based on ARM Cortex-A9, a 45nm process. That is, this choice makes the public are more disappointed with RIM, because everyone will think that RIM will use the processor of the quad-core OMAP5 platform, thereby causing it to ASUS Transformers Prime, Apple iPad3 (graphics processing capabilities) and the nearest Samsung Galaxy Note 10.1 The machine reaches the same level.
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OMAP 4460 pull scratches
Omap 4460 temple
TI another key design includes reproduced WL1283C, single-chip WLAN WILINK 7.0, GPS, Bluetooth 4.0, and FM solutions, which can also be found in the first version of PlayBook, which is also used in the first version of Playbook Manage IC TWL6030, boost converter TPS63021 and various ICs related to power management.
As RIM is transferred to a tablet, some people want to know whether Ti will prioritize in their baseband components and related ICs. Surprisingly, Qualcomm increases the new PlayBook's LTE chipset and related IC portfolios as seen in other LTE handheld devices. Qualcomm's MDM9200 is a GSM / W-CDMA / LTE baseband processor. This processor works with the RTR6800 receiver and the PM8028 power management chip connection. These ICs can be seen in the iPhone 4S and iPad 3.
Other key components
The ICs that appear in the new old version of PlayBook include ST's 5 megapixel image processor STV0987, ISL951 battery charger expects Wolfson Micro's VM8994E audio decoder.
The 16GB version of the new PlayBook LTE memory has multiple vendors. Samsung provides a 46nm process 1G low-power DDR2 SDRAM system memory and available memory with multi-chip memory components. Sea Keers offers SLC NAND Flash, which is used in PlayBook LTE communication mode. This SLC Flash is a 40nm process.
One of our very interesting components found in this device is NFC Solution Module Secure Secure SECUREAD IC 5C633I4. This proves that the new PlayBook has implemented NFC applications.
All in all, Playbook LTE's engineers are different from the original version of PlayBook in terms of semiconductors, ICs and modules. It is worth looking forward to whether it has added RADIO, while the ability of LTE can set off a big impact in over-flooding tablet market. Also or if the PlayBook LTE will go far from the earth, whether it can sell the product to the user's hand. The answer to RIM's expectations is of course affirmative.
Turn out the picture to watch the dismantling process.
Key components list:
Dual-core application processor based on ARM Cortex-A9 Ti OMAP 4460
Samsung 46nm process 8Gbit LPDDR2 DRAM K3PE8E800M (1GB DRAM)
WM8994E audio decoder and power amplifier for Wolfson microelectronics
Ti's TWL6030, Power Management / Switch Mode Charger
Samsung multi-chip memory components KLMBG8FEJA-A001, 4GB MLC NAND FLASH
TI boost converter TPS63021
INTERSIL battery charger isl951
Fai Zang semiconductor regulator FDMC7200
Fair Semiconductor's P-channel power supply MOSFET FDMC510P
Ti's boost converter TPS63020
St-Ericsson 500 play pixel mobile image processor STV0987
Maxim 2.4W stereo D power amplifier MAX98302
Ti 4-bit dual power bus transceiver SN74AVCH4T245
INVENSENSE 3-axis gyroscope MPU-3050
Freescale 3-axis accelerometer MMA8450Q
Qualcomm's RTR8600 supports GSM / CDMA / W-CDMA / LTE and GPS
AVAGO's LT / W-CDMA BAND IV Power Amplifier Module ACPM-5004
SLC NAND FLASH H27S1G8F2BFB of Hissidian 40nm Process
High pass GSM / W-CDMA / LTE baseband processor MDM9200
SP10T Antenna Switch Module RF Equipment RF8889A
TI WiLink 7.0 Single Card WLAN, GPS, Bluetooth 4.0 and FM Solutions WL1283C
WLAN power amplifier and switch TQP6M9002
Motherboard:
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Back surface of the motherboard
The front of the motherboard
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