Barcelona February 27, Qualcomm officially launched a new Qualcomm Snapdragon 700 series mobile platform at the MWC show currently held, which is positioned between the high-end 800 and the mid-end 600 series. Previously, only feature and performance supported by the flagship Snapdragon 800 Series mobile platform, which have a good embodiment on this new platform.
In Artificial Intelligence (AI), the Snapdragon 700 Series will integrate multi-core Qualcomm artificial intelligence engine AI ENGINE, compared with the Snapdragon 660 mobile platform, brought twice aspects in terms of artificial intelligence applications on terminal side, and has up to 30% Efficacy improvement.
In addition, the Snapdragon 700 Series also supports Bluetooth 5.0 and Quick Charge 4+ fast charging technology, which can be filled with 50% in 15 minutes. According to Qualcomm in the press conference, the first batch of Snapdragon 700 Series Mobile Platform is expected to be commercially available in the first half of 2018. This means that it is equipped with a terminal product such as a mobile platform, waiting until the second half of this year.
In addition to the Snapdragon 700 series, Qualcomm has also released the Snapdragon 5G module solution. This solution is designed to help those who want to make full use of the original equipment manufacturer (OEM) of 5G technology, and support them to quickly commercially available 5G in smartphones and main vertical industries.
By integrating the most basic 5G component into simple module, Qualcomm wants to simplify terminal equipment design, reduce total cost of cost and support faster commercial time, and ultimately let newly entered OEM vendors accelerate 5G in its system.
Dr. Chen Ruo Wen, senior vice president of Gao Tong QCT, said: "The world is expected to carry out 5G network and terminal deployment in 2019. Provide system-level expertise and integration to OEM manufacturers through a new 5G module, Qualcomm is helping to accelerate the industry to 5G The unique position of the transition. "
Qualcomm's new 5G module solution integrates more than 1,000 components in several module products, and further reduces the complexity of the terminal, speeding up the deployment and reducing the threshold. This highly integrated solution supports OEM vendors to design only by combining several simple modules, avoiding complexity using more than 1,000 components to create their terminals.
In addition, the module product provided by Qualcomm integrates components covering numbers, radio, connection, and front-end functions. Key components include application processors, baseband modems, memory, PMIC, RF front-end (RFFE), antenna, and passive components, providing OEM vendors to optimize solutions, supporting them to make it easy to make quick production at lower costs and less time .
Qualcomm said that the 5G module released is expected to be as designed in 2019. Customers will benefit from the deposit area of up to 30% compared to product design with separated independent components.
Original address: https://www.eeboard.com/news/ai-660/
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