Qualcomm launches the world's leading high-energy single-mode NB2 (NB-IOT) chipset - Qualcomm® 212 LTE IoT modem, lead wireless technological innovation

On April 16, 2020, QUALCOMM Qualcomm announced the launch of the world's leading high-energy single-model NB2 (NB-IOT) chipset - Qualcomm® 212 LTE IoT modem, this breakthrough new product is designed to promote honeycomb networked growth, Continue to lead wireless technological innovation. It is reported that the Global Mobile Communications System Association (GSMA) data shows that 2024 global honeycomb networked connections will reach 32 billion. Energy efficiency is the most critical feature for the IoT terminal that needs to continue to run a few years. The QUALCOMM® 212 LTE IoT modem uses a top high energy chip architecture, with only 1 microam (1ua) sleep current, so extremely low average power consumption. In order to support the power-on terminal of different kinds of batteries, the service life of the terminal is extended. The modem combines ultra-low system-level cutoff voltage, which can adjust the electricity usage according to battery charging state, and support the terminal device to maintain the power supply level as low as 2.2. Volt. VIERI VANGHI VIERI VANGHI, Vice President, Inc. Product Management, said: "QUALCOMM® 212 LTE IoT modem will help open a new era of extensive network applications worldwide, especially those deployed in the depths of buildings. Application, for example, it is necessary to operate 15 years or even longer-time use of the Internet of Things terminal. QUALCOMM 212 LTE IoT modem ultra low power, small and low cost, will create a new generation of low-power Internet access for OEM manufacturers The terminal brings great advantage. " QUALCOMM 212 LTE IoT modem supports single-mode 3GPP Release 14 Cat. NB2 IoT connection, which is expected to provide a larger coverage of delay in sensitive applications, and support global roaming. This modem integrates a modem baseband, an application processor, memory, and RF transceiver equipped with full-integrated RF front ends in a compact single-chip solution, and can support LTE modules with less than 100 square millimeters. The modem integration is high, and the external components are small. While reducing the cost of the module, the module design time is shortened, thereby helping the OEM vendor to accelerate the commercial use of the product. QUALCOMM 212 LTE IoT modem Integrates ARM Cortex M3 Application Processor and Original Bioconnet Data Network Protocol, thus supports embedded IoT applications. QUALCOMM Technologies also released the SDK used with Qualcomm 212 LTE IoT modem, which is intended to support developers to run custom software on the integrated application processor while preparing to support support to cloud platforms, such as Microsoft Azure IoT SDK. Source from Moore Law.

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