In 19 years of 5G in the first year, although many brands have released 5G mobile phones, the overall price is high, until the red rice K30 5G breaks into the market at the lowest 1999 price. I want to have and small E, and the K30 will not control costs, and "stealing work and reduce"?
Due to the reason for the purchase, Xiao E purchased 8GB + 128GB. Therefore, the following dismantling analysis data is subject to the procurement equipment.
E dismantles
First take it out of the set of cartoons with silicone circles. The rear cover is fixed by the adhesive, and the heat gun is heated and the rear cover is slowly opened.
The motherboard cover and the speaker are fixed by screws, and the large-scale graphite sheets are covered in the main board and the battery position, which is beneficial to heat dissipation. A block antenna plate is fixed on the front of the speaker.
The NFC coil, the rear camera cover and the antenna are fixed by the gum, and removed.
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The main board, the front and rear cameras, and other components are removed.
It can be seen that the internal support corresponds to the motherboard processor & memory position, not only coated with heat sink, but also contact with the heat dissipation copper pipe. Copper foil and protective and heat dissipation are also on the camera soft board. Secondary board, headphone holes and USB interfaces, silicone sleeves for waterproof.
The battery is supported by two easy-pull gelatin, and removes the battery.
Remove the button soft plate, handset, sensor soft board, etc. The side fingerprint recognition sensor soft plate and the buttons are provided with a silica pad for protection, and the sensor soft plate also has a silicone sleeve.
The screen is fixed by the inner support, and the screen can be separated from the inner support by the heating screen.
RedMi K30 5G uses three-stage design, the overall design is strict, and it is not inferior. The waterproof design of the whole machine, in the SIM Cardruce, the USB interface and the earphone hole are used for waterproof. The heat dissipation is heat dissipated by graphite sheet + heat dissipation silicone-liquid cold copper tube. And the motherboard and battery position are also attached to the large-area graphite sheet for heat dissipation.
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E analysis:
EWISETECH has a total of 1364 components by disassembling Red Rice K30 5G (8Gb + 128GB), and the overall component estimate is approximately US $ 210.92, of which the main control IC occupies 51%. However, what is the main control chip on the motherboard?
The motherboard front:
1: QUALCOMM-QPM5677-RF power amplifier chip
2: QUALCOMM-QPM6585-RF power amplifier chip
3: QUALCOMM-SDR865-radio frequency transceiver chip
4: QUALCOMM-WCN3998-WiFi / BT chip
5: QUALCOMM-WCD9385-audio codec chip
6: Samsung-KM8V8001JM-8GB memory + 128GB flash memory
7: NXP-SN100T-NFC control chip
8: QUALCOMM-SM7250-Qualcomm Snapdragon 765G processor chip
9: QUALCOMM-PM7250B-Power Management Chip
Back surface of the motherboard:
1: QUALCOMM-PM7150L-Power Management Chip
2: QUALCOMM-PM7250-Power Management Chip
3: RF front end module chip
4: QUALCOMM-QDM2310-radio front end module chip
5: RF front end module chip
6: qorvo-qm77040-radio front end module chip
7: qorvo-qm77032-radio front end module chip
It can be seen that the IC part is mainly from the United States, so if the cost of the device is classified, it is still the highest in the US, accounting for 32.9%, providing 57 components. But in the component TAP5, it is the best in Korea.
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Source ewistech
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