ST new duplexer boosts intelligent terminal Wi-Fi performance

In the field of multi-electronic applications, the world's leading semiconductor supply commercial semiconductor (StMicroelectronics, ST) releases a chip that enhances mobile products such as smartphones, tablets and other mobile products. This innovative product enables designers to save space and battery energy consumption, add more features to application design and extend battery life. The new product DIP2450 duplexer for semiconductors is used to connect Wi-Fi wireless chips and antennas to simplify circuit design, saving printed circuit board space, and also connects a Bluetooth IC to the same antenna. With the integrated passive device (IPD) process of the Semiconductor, the DIP2450 has a very small size, only 1.1 x 1.25mm, which can efficiently transmit signals, combined with high-speed communication performance and low power consumption. The DIP2450 supports the latest high-speed dual-frequency Wi-Fi standard (IEEE 802.11n), multi-channel communication can be performed at 5GHz bands, while also supporting current 2.4GHz wireless communication protocols. Dual-frequency techniques improve Internet user capacity and data rates for each user. Support IEEE 802.11n standard mobile Internet speed has exceeded 60Mbps, which is higher than the world's fastest mobile broadband average Internet speed 50 Mbps in Hong Kong, Japan and South Korea. The DIP2450 duplexer of Semiconductors has been used for ST-Ericsson CW1260 multi-frequency mobile to apply dual-band Wi-Fi system-level chips. The CW1260 will also use two other IPD products of two embodies: 5GHz bandpass filters and match balance - unbalance converters (a signal converter). The overall solution can reduce system power consumption, extend battery life, save printed circuit board space, and reduce the number of components. STMicroe has a series of RF IPD devices with cost optimization and small volume advantages, which can reduce system power consumption of Wi-Fi, Bluetooth, ZigBee, WiMAX, and 3G LTE. The product range includes a duplexer, a filter, a balance-unbalance converter, a radio frequency coupler, a three-worker, and an impedance matching device. Eric Paris, Director of Semiconductor ASD and iPad Products, said: "The new duplexer has high-speed Wi-Fi performance, which represents the leadership of STMicroelectronics in the high-performance RF front-end device market, and can provide the highest integration, minimum Bit area and optimal power size ratio of products. " Main features of DIP2450-01D3: ● The placeholder area is less than 1.4mm2 ● Ultra-thin volume (less than 600 μm after reflow soldering) ● Typical insertion loss 0.6dB (2.4GHz and 5GHz) ● High distortion ● High band crossing frequency suppression ● IPD integration achieves stable and repeatable RF front end feature DIP2450-01D3 has been put into mass production, using 1.1 x 1.25mm 4 solder ball crystal circular stage package (WLCSP).