"With the withdrawal of Globalfoundries and liandian from the R & D and investment of advanced semiconductor processes, only Intel, TSMC and Samsung are left in the world with the ability to develop processes of 7Nm and below. However, Intel can be excluded from the foundry, and other companies without wafers can only choose Samsung and TSMC. Among them, TSMC can win a big victory at the 7Nm node, There are more than 50 types of 7Nm chips. In recent years, Samsung has also focused on the OEM business. Previously, Samsung boasted to strive for 25% of the OEM market. This year, Samsung announced the future process roadmap. Now at the technology forum in Japan, Samsung has refreshed the semiconductor process roadmap again. This year, it will launch 7Nm EUV process, next year, it will launch 5 / 4nm EUV process, and in 2020, it will launch 3nm EUV process, At the same time, the transistor type will also shift from FinFET to GAA structure.
Samsung Electronics held the "Samsung wafer foundry forum 2018 Japan Conference" in Japan on the 4th, referred to as SFF Japan 2018. This is the second foundry conference held by Samsung in Japan. The Japanese pcwatch website introduced the main contents of Samsung's conference. Samsung's slogan is "the most trusted foundry" and announced Samsung's latest roadmap in wafer foundry.
Samsung executives said that the 7Nm FinFET EUV process will be launched later in 2018, and the 8nm LPU process will also start risk trial production. In 2019, the 5 / 4nm FinFET EUV process will be launched, and the risk trial production of 18NM fd-soi process will be started. The latter is mainly for RF, emram and other chip products.
In 2020, Samsung will launch the 3nm EUV process, and the transistor structure will be greatly changed. From the current FinFET to the GAA (gate all around) structure, GAA is recognized as a new generation technology candidate to replace FinFET transistors after 7Nm nodes.
Samsung said at this forum meeting that they are the first company to mass produce EUV process, which is true. TSMC will not use EUV process until the second generation 7Nm process N7 +, but Samsung is more radical. 7Nm process will be directly used on 7Nm nodes, and EUV process will be fully used on 5 / 4 / 3nm nodes in the future.
According to Samsung, they deployed ASML nxe3400 EUV lithography machine on S3 line in Huacheng, South Korea. This production line was originally used for 10nm process, but now it has been transformed. It is said that the current EUV production capacity has reached the standard of mass production.
In addition, Samsung is also building a new production line outside the S3 production line, which is dedicated to the EUV process. It is planned to be fully completed by the end of 2019, and the full mass production of EUV is planned to be completed by 2020.
For Samsung, it's very important who their 7Nm customers are. Especially when TSMC grabs the vast majority of 7Nm orders, the original author believes that TSMC's 7Nm production capacity can't cover all 7Nm orders, and Samsung still has the opportunity to win customers. Therefore, he speculates that the next generation GPU of a company may be OEM by Samsung - but he emphasizes that this is his own speculation.
In GPU OEM, Samsung used 14nm process to OEM the gp107 core of nvida's GTX 1050 Ti / 1050 graphics card.
The following is Samsung's Roadmap in packaging test. At present, Samsung can provide foplp pop and i-cube 2.5D packaging. Next year, it will launch 3D SIP system level packaging. Among them, i-cube packaging can realize 4-way HBM 2 video memory stack.
Original address: https://www.eeboard.com/news/4nm-euv/
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