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    Samsung Galaxy A6 + dismantling evaluation: not only look at the appearance, but also in the internal design

     

    How many small partners have been covered in several Taiwan's Samsung Mid-range market equipment. This is not as for us to send it to everyone, first use A6 + to open a head, and more popular products waiting for you! Configuration list Still, look at the basic configuration of the equipment (the following parameters are small E-family engineers, or have access to official data). SOC: Equipped with Qualcomm Snapdragon 450 processor L 14nm LPP process Screen: 6.0 inch Samsung Super AMOLED screen 丨 resolution 2220x1080 丨 Screen accounts for 75.6% Storage: 4GB RAM + 32GB ROM Front: Samsung 24MP camera Back: Samsung 16MP camera + Samsung 5MP camera Battery: 3500mAh lithium-ion battery Features: three-stage magnesium lamp 丨 post fingerprint face double recognition 丨 three card dual standby Dismantlement step First, the SIM card is taken, and A6 + is also removed, and the screen is heated to 80 ° C. The suction cup is slowly opened around the slit, and it is necessary to pay attention to the screen cable in the lower left corner and the motherboard during the dismantling process. There is a large-area heat-dissipating copper foil on the back of the screen, and the radiating graphite is also attached to the corresponding battery portion. There is also a large-area transparent double-sided adhesive on the heat dissipation copper foil for fixation between the screen and the middle frame. The screen touch soft board and the screen flashboard interface are reinforced with a yellow translucent insulating tape. In the middle frame, there is a black bubble in the middle frame to protect the IC site. There is a waterproof label on the lower right corner of the middle. It can be seen that A6 + has worked in detail. In the middle frame and the rear shell are fixed by 17 screws, the rear shell and the middle frame portion first look at the detail portion. There is a black bubble and a white pressure balance film on the vibrator surface and the speaker plastic shell, respectively. On the rear shell, the inner bubble shock absorbing material in the inside of the double camera protection frame. The motherboard shield is fixed with the rear cover contact position and has insulating stickers. The motherboard and speakers are fixed using screws, while batteries, handset, and headphone holes are fixed by double-sided adhesive. The main board, medium box, SIM card slots are labeled, and the waterproof labels attached to the SIM card slots are plastic film. The main camera is bonded to the motherboard by transparent double-sided adhesive, and the fingerprint sensor and the vibrator that removes the rear shell can be configured to be fixed by double-sided adhesive. Module information The screen uses Samsung 6.0 inch 2220x1080 SUPER AMOLED screen. Be The rear is double-headed, which is 16 million three-star camera + 5 million three-star camera. Front 24 million three-star camera. The battery is 3500mAH with a model of Samsung. The battery cell manufacturer is a Samsung SDI, quality or can. Motherboard IC information The main IC of the motherboard (below): RGB Red: Samsung - KMRX60014M - 4GB RAM + 32GB ROM Huang: QUALCOMM-SDM450- Baseband Processor, Octa-Core 8X1.8GHz Deep black green: ABOV-T346AU- Touch MCU Deep Black Red: NXP- TFA9872Cuk-Audio Amplifiers Pure Yang: StMicroelectronics-LSM6DSL- 6-Axis Accelerometer + Gyroscope Deep black warranty: Capella Microsystems Inc.- CM36658 - ALS / Proximity Sensor RGB Blue: RFMD- RFFM8506- 5.0 GHz WiFi Front-End Module RGB Magenta: QUALCOMM- WCN3660- Wi-Fi, Bluetooth, FM RGB Green: Silicon Mitus- SM5708- Smart USB SWICHES Featuring Automatic Power Pure blue: Silicon Mitus-W8912-Front-End Module The main IC on the back of the motherboard (below): RGB Green: NEPES - SM5326A - E / P Anti POP Up IC Pure Blue: Skyworks- Sky77786-11 - WiFi Dual-Band (2.4 GHz and 5 GHz) Pure Blue Purple: HV451 - Power Amplifier Module Pure Green Beat: Skyworks - Sky77656-11 - Multimode MultiBand Power Amplifier Module Pure Green: Qualcomm - WTR3925 - RF Transceivers for 2G, 3G and 4G LTE Pure Red Orange: QUALCOMM - QFE2101 - Average Power Tracker Pure Huang: Qualcomm - PM8953 - Power Management RGB Red: Yamaha - Yas539 - 3-Axis Electronic Compass See the table below for logic, memory, pm, and RF chip used on the motherboard. MeMS chip usage information on the motherboard is shown in the table: Summary information Galaxy A8 is fixed using a cross screw. In the middle box, the SIM card slot, the motherboard is posted on the front of it. In terms of heat dissipation, the screen is combined with a full-screen sink copper foil with a large-area graphite, and plastic sheets are also attached to the corresponding battery position. The motherboard is thermally conductive silicone, graphite, and copper foil, and the shield in the CPU position has a thermally conductive silicone, and the shield has a heat-dissipating graphite, and the overall heat dissipation treatment is relatively strong. Search for the panel network, pay attention, daily update development board, intelligent hardware, open source hardware, activity and other information can make you master. Recommended attention! [WeChat scanning picture can be directly paid]

     

     

     

     

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