In the near future, the middle and low-end equipment of major brands have been dismantled, but they have not seen Samsung. This is not Samsung Galaxy F52 (5G)! Equipped with a 6.6-inch TFT screen of Qualcomm Dragon 750g, 120Hz refresh rate, 8GB + 128GB price of 1999 yuan. There are also many small partners to expect dismantles when opening the box. Then I will be dismantled!
E dismantling:
Take out the calorker, there is no silicone ring on the calorie. The glass rear cover is heated by the hot air gun, and the back cover is slowly opened by the suction cup and lesks, and the bubbles are attached to the back cover for protection.
Remove the fixed screw, open the card with a crow, separate the rear end cap, the camera cover on the rear end cover and the flash plate with the adhesive. There are large-area graphite sheets on the back cover and on the motherboard for heat dissipation.
Remove the main panel, front and rear camera, speaker fingerprint identification soft board and RF coaxial line. On the motherboard, we can see that the front processor position of the motherboard is attached to the back surface of the back, and the silicone and copper foil are attached. In addition, a metal cover protection is provided in the BTB interface of the front camera. Silicone circles are provided on the USB interface and the headphone interface.
The battery is not fixed with easy to pull the paper, which is the same as the button soft plate, the earpiece, and the vibrator.
The screen is supported by the inner support. The separation screen is heated with a heating station. F52 uses a screen soft board to connect the soft board in the main panel. And the screen of F52 is not its own Samsung screen, but the same as a domestic peering.
The F52 machine is fixed with 20 screws, divided into screen + inside support + rear end cover + back cover four-layer structure. The heat transfer silicone + graphite is used in the heat dissipation, and a liquid cold tube is not used. The USB interface is provided with a silica gel ring at the earphone hole, which can play a certain dust. Particularly, the main panel connection soft board and screen soft board of F52 are the same cable. Overall, the dismantling is simple, and it is reducing.
E analysis
The title is said that the discovery of ewisetech in F52 is again improved. In the dismantling, we also mentioned that the screen adopted a domestic Tongxing. In the chip, we also have some discovery, first take a look at the main IC of the motherboard.
The main IC of the motherboard:
1: QUALCOMM-SM7225-Qualcomm Snapdragon 750G Bar Nuclear Processor
2: Samsung-KM8V8001JM-B813-8GB memory + 128GB flash memory
3: QUALCOMM- SMB1395-Quick Charge 3+ power management chip
4: Foursemi-SPC1910-audio amplifier
5: LANSUS-FX5627H-RF amplifier chip
6: LANSUS-FX5627K-RF amplifier chip
7: QUALCOMM-WCN3988-WiFi / BT chip
8: Memsic-MMC5603-electronic compass
The main IC on the back of the motherboard:
1: LANSUS-FX5805A-RF amplifier chip
2: QUALCOMM-PM6350-Power Management Chip
3: QUALCOMM-WCD9370-audio decoding chip
4: QUALCOMM-QPM5577-power amplifier
5: QUALCOMM-SDR735-radio frequency transceiver
First, you can see that the front of the motherboard has a FOURSEMI audio amplifier, which is from domestic Fourier Technology, which previously found the vendor chip in the Meizu 16XS.
Second, we can see three radiofrequency chips from Shenzhen Feiyi Technology in the motherboard. FX5627H, FX5627K, FX5805A. The 5G application of each frequency band can be fully met.
In the 4G era, the radio frequency chip in the mobile phone is basically monopolized by foreign companies such as Qorvo, Skyworks, Avago, Village and Qualcomm; although the domestic PA chip begins to emerge, according to the current ewistech data, It is very rare to use a domestic PA chip in Samsung. This is also the first discovery of domestic PAs in the Samsung's equipment, and Shenzhen flying radio frequency amplifier chip, in the evening of the glory V40.
According to EWSETECH organizes the entire machine BOM, it is found that the increase in the proportion of China's production devices in F52 is very obvious. Of course, the machine BOM is still inquiry in the Ewistech search.
The above is the dismantling and analysis of Samsung Galaxy F52.
(The above content is derived from Ewistech Authorization)
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