I'm going back to the basic dismantling part of the soft mobile phone. I don't know if my friends can't wait to enter Ewistech. Don't worry, don't worry, today, small E is as scheduled to share about the folding hinges and components information!
There is not much nonsense to enter the dismantling mode, and there is a layer of silicone sleeve on the folding module, which is fixed by ten screws on both ends and the inner support, and fixed in the intermediate position of the silicone cassette, when dismantling the silicone sleeve Pay extra.
The soft part is very difficult to dismantle the screen. When we dismantled the camera's protective cover, we found a lot of glue. In terms of screen, in order to prevent the screen, the screen is deformed, foamed, and the back surface of the screen on both sides. The overall heating screen is needed, and then slowly with the leatch to dismantle the screen.
After dismantling, you can see that the screen corresponding to the battery is fixed by black double-sided glue, and the corresponding motherboard is fixed by the conductive tape with the back patch.
The internal support of the battery side can be pulled directly when the screen dismantling is completed, but the folded chain is supported by the inner support of the motherboard or the patch of the back side. And the welding contact point is filled on the metal sheet.
First separation of the folding chain and internal support, and then remove the metal sheet. The metal sheet is in opposite sides of the metal plate, and all screws on the front of the folding chain are all screwed, and the welding contact points can be removed.
The soft part uses 139 screws in the whole machine, and 100 is used in the folding module. It is a mobile phone that has used screws in recent years. The folded adsorption is a magnet that supports the edges of the edges of the left and right.
The folding module mainly uses the welding and screw connection, and the principle of motion is not complex. The hinges are connected to the gentle teeth, and the sliding groove is also limited to the hinge rotation when the hinge is rotated. The sliding angle is limited to it.
Among them, the screen uses a 7.8-inch dragonfly TM flexible screen second generation, unfolded state resolution 1920x1440, pixel density 308PPI flexible AMOLED screen.
Motherboard IC information
Want to know which chips are logic, memory, pm and rf used on the motherboard? Then you have to poke Ewistech official website, not only a detailed chip information in the dismantling channel, but also HD pictures waiting for you to check it out! First labeled what chips do you have on the motherboard?
The main IC of the motherboard (below):
Red: qorvo- - High-frequency radio frequency fusion module
Yellow: qorvo- - RF power amplifier
Deep blue: QUALCOMM- - Power Management
Cyan: qualcomm - - RF transceiver chip
Green: QUALCOMM- - Power Management
Purple: QUALCOMM- - Audio Codec
Deep Green: AWINIC- - Audio Amplifier
Pink: QUALCOMM- - WiFi / BT chip
Brown: qorvo- - RF integration front end module
The main IC on the back of the motherboard (below):
Red: QUALCOMM- - High-pass 855 Bar Nucleus Processor
Yellow: SK HYNIX- -6GB memory
Cyan: Samsung - -128G memory
Pink: QUALCOMM- - Power Management
Deep blue: Invensense- - Gyroscope + Acceleration Sensors
Orange: Liteon- - Light / Distance Sensor
Reproduce the MEMS chip information used by the small partners in advance!
According to the analysis of the EWSETECS searches, there are 1464 components, with a cost of approximately $ 312.72. Among them, the main control chip portion accounts for about 41% of the total cost. The main area of the components of components is non-electronic device, screen, connector, cost proportion of cost, 46%. It can be seen that the cost of flexographing screen is large. In addition, there are more detailed components information and analysis data in ewistech!
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Source: ewistech
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