Shengmei Semiconductor is performing verification of 3D TSV and 2.5D adapter board copper-plated applications

STAD STMic Devices (NASDAQ: ACMR), as a leading equipment supplier in the semiconductor manufacturing and advanced crystal circular package, recently released silicon venting electroplating apparatus applied to filling 3D silicon vent (TSV) Ultra ECP 3D. With a platform for Shengmei semiconductor plating equipment, the device can provide high-performance, non-hole copper-plated function of high-profile ratio (H.A.R) copper applications. According to industry research firm Mordor Intelligence said: "The 3D TSV equipment market has reached $ 2.8 billion in 2019, and in 2020-2025, the annual growth rate of 6.2%, in 2025, the market will reach 4 billion US dollar. "1 Key market using TSV equipment mainly includes imaging, storage, microcircular system, and optoelectronics. Wang Hui, chairman of Shengmei Semiconductor Equipment, said: "Many factors have promoted the growth of the 3D TSV market, from the device miniaturize to artificial intelligence and edge calculations, these applications require more powerful processing power in higher density packages, this The industrial adoption of silicon vent technology is accelerating. " Dr. Wang Hui also mentioned: "In cooperation with customers, we have successfully demonstrated the ability of the silicon vent to fill high and wide than through holes. In addition to increasing capacity, the stacked cavity design is designed. The equipment can also reduce the use of consumption, reduce costs, save valuable use area in the factory. " During the high and width of the silicon via, the copper electrolyte is immersed in the electro-plating, and the via must be completely filled, and any bubbles cannot be retained. In order to accelerate this process, we use an integrated pre-wetting step. This advanced technical solution can ensure higher benefits, electroplating efficiency and capacity in the manufacturing process. The Ultra ECP 3D device applied to 3D TSV is equipped with 10 cavities, applied to 300mm, integrated pre-wet, copper-plated and post cleaning modules, only 2.2 meters wide, 3.6 meters deep, 79 meters high. Shengmei Semiconductor Equipment has recently delivered the first ULTRA ECP 3D device to China's key customers and began to officially perform verification of 3D TSV and 2.5D adapter board copper-plated applications. Editor in charge: Tzh, Read more

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