Silicon Labs has launched two affordable and easy-to-use development kits for a wide range of Internet of Things (IOT) products to help developers accelerate environmental and biometric identification of sensing applications. Target applications for these development kits include home security systems, intelligent thermostats, smoke detectors, weather stations, smart watches, fitness bands, heart rate headphones and other wearable products.
Silicon Labs SLSTK3201A environmental sense development kit greatly simplifies the development of an Internet product development with induction relative humidity, temperature, ultraviolet, ambient light, proximity, and gesture recognition capabilities. The development kit includes an EFM32 Zero Gecko Microcontroller (MCU) entry suite and sensor expansion board. In addition, the development kit also has a meteorometer application that tracks gestures controlled relative humidity, temperature, and ultraviolet index. Complete source code can be obtained free of charge from Silicon Labs's Simplicity StudioTM development platform, greatly shortening the development time of application products.
Silicon Labs's new biometric detection development platform can more easily measure heart rate and blood oxygen level (SP02), including ultraviolet index, relative humidity, and temperature. The platform includes a Biometric-Exp-EVB expansion card equipped with Silicon Labs Si114X optical sensors and Si701X / 2X relative humidity and temperature sensors. The sensor card can be inserted into the Silicon Labs EFM32 Wonder Gecko MCU entry kit. Silicon Labs also provides an optional wearable shape HRM-GGG-PS plate that supports wrist-type heart rate monitoring, and can be connected to biometric identification sensor cards via I2C micro flexible cable.
The library module includes a heart rate logic algorithm with a source profile without the need to develop biometric identification sensor driven from the head.
The environmental and biometric identification sensing kits are powered by a button battery, which can be seen that Silicon Labs provides industry-leading Internet access and wearable applications providing industry-leading ultra-low power MCU and sensor IC products. Each sensor expansion card uses Silicon Labs's TS3310 boost DC / DC converter to reduce energy consumption.
Silicon Labs Vice President and Simulation, General Manager of Power and Sensor Products, "High Accuracy, Ultra-low Power Environment and Biological Characteristics Identification Induction Capacity and Energy Saving MCUs and standard wireless connections are the Today's Internet The key to wearing applications. Silicon Labs Sensor IC provides advanced humidity, temperature, ambient light, UV index and proximity sensing technique for the Internet of Things. Through our various types of plug-and-play development kits and Simplicity Studio software development tools, developers can greatly simplify their product design and shorten the product launch time. "
Environment / biosensor about Silicon Labs
The prepared Si701X / 2X relative humidity and temperature sensor fuses a single chip mixed signal IC and a humidity measurement method using polymer dielectric film patented technology. Integrated CMOS design ensures long-term reliability and excellent ease of use, reduces manufacturing costs and complexity. The optional factory-installed filter protection cover provides additional anti-pollution protection in the entire life cycle. In addition, the Si701X / 2X sensor provides optimal low power performance and excellent relative humidity induction accuracy.
Si1132 / 4X optical sensor is the industry's first single-chip digital UV index sensor IC, which enables wearable products and smartphones to track ultraviolet sunlight intensity, heart rate and blood oxygen measurement. The chip also provides ambient light and infrared proximity induction capabilities for health and fitness applications. Common ultraviolet sensors use ultraviolet induction photodiodes and sheets MCU, ADC, and signaling firmware. Silicon Labs is the first manufacturer that combines all features in a single-chip, low power solution, which provides minimal 2mm x 2mm package to reduce board area and material cost.
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