Sony officially released Xperia XZ at the IFA 2016 conference, and on October 13, the National Bank Xperia XZ pre-sale. The XPERIA XZ monolithically continues the simple and fangd design style of the Sony flagship, but the rear cover is changed from the previous glass material to a metal, and the trunteer structure.
Then the XPERIA XZ internal structure has a large change, and the following is analyzed by the EWISETECH engineer.
The main machine main configuration: 5.2-inch display, 1080p resolution, equipped with high pass 820 processor, run the Android 6.0 system, 3GB memory + 32GB flash memory, and support up to 256GB of Micro SD card expansion; 2900mAh polymer lithium battery; 23MP post Camera (add laser focus and RGBC-IR white balance sensor) + 13MP front camera; use positive anti-swap USB TYPE-C interface; side power button integrated fingerprint recognition function; support the highest IP68 waterproof and dustproof.
Sony mobile phone is generally a rear split assembly structure, Xperia XZ is the front demolition structure, removes the double SIM card slot on the left side of the body, and the hot air gun is around 100 degrees, and the suction cup remove the screen. The top of the screen is a handset module, and the speaker works with the speaker at the bottom of the fuselage in the music.
The touch screen uses the S3330 touch chip of Synaptics.
There is a black waterproof sealing cotton rubber with the surrounding screen and the handset position.
The SIM card tray is a soft sealing rubber material with the end of the SIM card.
Remove the stainless steel support plate of the SIM card slot sticker and integrated battery / NFC coil.
White-free adhesive adhesive batteries commonly used in Apple phones are used to facilitate disassembly replacement batteries.
Sony Electronics Produced by a 2900mAH lithium polymer battery for Lis1632ERPC.
NFC coil on the back of the metal plate.
Remove the USB TYPE-C / microphone sub-plate and side bond / vibration motor soft plate.
The microphone board is connected to the USB Type-C soft plate through the ZIF interface.
The USBTYPE-C interface is integrated with a circle of red sealed rubber circles.
Fingerprint identification on side key soft plate, power button.
Remove the main antennas and coaxial modules at the bottom.
The back of the main antenna frame is integrated with a speaker module.
Remove the motherboard and front and rear camera modules.
13MP front camera and 23MP rear camera.
Laser focus sensor, RGBC-IR sensor and flash on the motherboard. Laser focus makes XPeria XZ cameras relatively quickly, and the joining of RGBC-IR sensors greatly enhances the accuracy of white balance and exposure.
The position of the sensor on the back of the fuselage.
Remove the headphone hole soft board module, volume and camera button on the back shell. It can be seen that the rear shell is different from the previous generation of products that have no integrated thermal copper tube for heat dissipation.
The earphone hole module is provided by the Alps (Alpine), with the bubble border by the foam.
EWISETECH engineer identifies: the main system is mainly integrated: WiFi / BT / FM / GPS chip; running memory + Qualcomm Snapdragon 820 processor; NFC controller; power management chip.
Main integration of the back: RF transceiver; power amplifier; gyroscope / acceleration chip; audio codec chip; 32GB flash drive; 2 speaker amplifier chip; power management chip.
Disassembly collection:
Summarize:
It can be seen that the interior of Sony XPeria XZ is mainly modular, the overall layout is comparable to the previous generation of products, but the rear shell is not like the previous generation of products such as the first few generations of products. Xperia Z5 integrated thermal copper tube for cooling. The battery is assembled with a seamless adhesive, which is convenient for dismantling repair. Rubber ring and foam glue are mainly used on the waterproof seal of the device.
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