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    Texas Instruments bring 2.4 GHz and 5 GHz Wi-Fi® and Bluetooth® combination modules for industrial and Internet of Things applications

     

    A few days ago, Texas Instruments (TI) announced that WiLinkTM 8 combined connection modules that support Wi-Fi in 2.4 GHz and 5 GHz bands designed to help manufacturers to easily add Wi-Fi® and dual-mode Bluetooth® to embedded applications. . With robust Wi-Fi + Bluetooth coexistence, this highly integrated new module series provides high throughput and expands industrial grade temperature range. WiLink 8 modules are ideal for home and building automation, intelligent energy, gateways, wireless audio, enterprises, wearable applications, etc. Industrial and Internet of Things (IOT) applications. Wilink 8 modules are compatible with software and many processors, including TI SITARATM processors, and can be pre-integrated with these processors. With the WiLink 8 Series, users do not need too much experience in hardware and RF (RF), WiLink 8 provides Wi-Fi, Bluetooth software stacks, and sample applications, and these modules have passed FCC / IC / ETSI certification. "As a fully integrated solution, WiLink 8 module can shorten the development time and accelerate product listing process. In addition, the cycle time required to obtain the necessary industry certification and management certification is also greatly reduced." Cisco (Cisco) Internet Life Gateway Project The senior architect Ken Sooknanan said, "For IOT products, there must be a variety of hardware variants to meet the needs of specific markets, and WiLink 8 modules can meet this need." The Wilink 8 Series provides an expandable flexible product combination by launching the pin-compatible 2.4 GHz and 5 GHz versions. Wilink 8 modules can achieve new cases and better user experiences with integrated Wi-Fi and Bluetooth, including: • The expansion level temperature range required for industrial applications (-40 ° C to 85 ° C) • New 5 GHz modules, enable customers to create high performance solutions with low noise frequency bands • Intelligent energy and home gateways with Wi-Fi, Bluetooth and ZigBee® coexistence, can manage multiple devices with Wi-Fi multi-channel multi-purpose (MCMR) feature • Using TI WiLink 8 MRC (Maximum Compare Merge) Technology, it can achieve up to 100 Mbps throughput and expand the temperature range to 1.4 times. • Optimization of low power applications can be implemented with lower idle connection current consumption • Adopt Wi-Fi and Dual-Mode Bluetooth / Bluetooth low-energy technology, audio streams suitable for home entertainment applications "The new WiLink 8 authentication module can bring cutting-edge connection technology for any customers, and make multiple different industrial and consumer applications to easily obtain development tools, software and support." Apace, General Manager, General Manager of TI Wireless Connection Solution Business Unit Ron said, "As a leader in embedded connection, TI is very happy to work with Cisco's customers to provide a complete IOT solution, including wireless connection, processor, and analog components." WiLink 8 Modules can be complemented by multiple TI platforms to provide a system solution for manufacturers, including WiLink 8 modules (2.4 GHz WL1835MODCOM8 and 5 GHz WL1837MODCOM8), which are compatible with AM3335x EVM and AM437x EVM. In addition, the WiLink 8 module provides Bluetooth and Bluetooth low-power dual-mode technology, and can also be compatible with TI Bluetooth product portfolios that allow developers to create full end-to-end applications. Related reading: AMD Embedded G Series SOC Assist Optimized GizMo 2 Development Board Texas Instruments make real-time programming Texas Instrument DLP LightcraftM 3010 Evaluation Module enables compact electronic devices to achieve high-definition imaging Mir Technology launched 3 TI AM335X industrial control boards to provide the most comprehensive program selection for the industry Spark releases only $ 19 IoT Wi-Fi Development Kit Texas Instruments announced that it will set up a 12-inch wafer bump processing plant in Chengdu, China Embedded cooperation model of "core board + bottom plate"

     

     

     

     

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