Since the birth of the modular mobile phone, we have heard of several modular mobile phone brands, such as the famous Google Project Ara program, Google has already displayed the prototype of Project Ara in the Google I / O conference in May, but distance True to sell, Google also has a long way to go. In addition to Google, there is another company FAIRPHONE that is equally fast, they have opened the fairphone 2 for the last month. When everyone has not got goods, IFIXIT has brought us the dismantling of Fairphone 2, let's take a look at this phone is not modular enough.
FairPhone 2 uses Snapdragon 801 SoC, 2GB memory, 32GB ROM and supports memory card expansion, using 5-inch 1080LCD screen, capacitive capacity is 2420mAh, and supports dual card dual card. Of course, for this mobile phone, all of which are all floating clouds, modularity is the weight.
The three rounds of this mobile phone are 143 × 73 × 11mm, with a weight of 168g. Although 11mm is not called thin in the current smartphone, only the only modular mobile phones are on the market, the concept is greater than everything. In addition to the modular design, this phone has superficially designed, and the official claims can withstand the fall of 2 meters and is not damaged. FairPhone also said that the future of the three defense levels will be launched.
The side of this mobile phone printed a "Designed to Open" and highlights its modularization concept. This phone consists of 7 major parts, back cover, detachable battery, display assembly, body frame, receiver module, rear camera module, and speaker module, is very simple.
We started disassembling from the back cover. This phone uses a translucent back cover. We can observe the internal circuit structure through the back cover. You can easily remove the rear cover without any tool.
Is there a detachable battery? Disassembly, there is course no difficulty.
This phone uses a 3.8V 2420mAh battery with a small capacity.
Now we continue to disassemble, and now have not seen any screws, the separation box and the display panel also need to open the bottom lock switch.
Next, we remove the display panel by sliding. We have not used any tools so far.
We can see that the display panel and the motherboard are connected by a large spring electric shock. The orange section is the connecting plate for the screen cable and the spring contact module.
Now let's take a look at which modules in the box part of the motherboard:
Red: Headphone jack, handset and front camera module.
Orange: Rear Camera module.
Yellow: Microphone module.
Demolition, we finally need a screwdriver! We need to remove all the screws in the blue circle, and the screws are standard cross screws.
After removing the screws, we remove all three modules.
We disassemble three modules one by one, first is the earpiece module. The screws on the module use the plum T5 screw, which requires a dedicated screwdriver to disassemble.
The internal structure can be seen after the module can be opened. Similar to the design of the ordinary mobile phone, the front camera is connected to the circuit board through the cable; the handset is connected to the board by contact; the headphone jack is directly soldered on the board.
Next we dismantled the post camera module, the rear camera module has only one screw. The rear camera has an inch 1 / 3.2-inch sensor and aperture of F / 2.2.
Finally, the microphone module. In addition to the microphone, this module also has a vibrating motor and a speaker. The USB interface and speakers are soldered on the board.
Finally, let's dismantle the motherboard part of this phone.
First remove the metal shield on the motherboard with tweezers, and there is a large graphite hot paste.
Next, we will hide the RF cable in the lower left corner, and there are two screws to fix.
Finally, the motherboard will be removed. We can see a slightly transparent plastic box with many contacts, built into the antenna and all buttons on the box, through the contacts and motherboards. The red box portion is a 5-pin spring contact, which is a USB 2.0 interface, which may be reserved for future development.
Now let's take a look at the chips of the motherboard:
Red: Samsung KLMBG4WEBC 32 GB EMMC NAND Flash
Orange: High-pass WCN3680B Wi-Fi 802.11ac and Bluetooth combination module
Yellow: Semiconductor LSM330DLC 6-axis accelerometer + gyroscope
There is more chip on the reverse:
Red: Samsung K3QF2F20EM 2 GB LPDDR4 RAM, Memory Chip Next to Qualcomm Snapdragon 801MSM8974AB SOC
Orange: high pass WTR1625L RF receiver
Yellow: RF Micro Device RF7389EU Multi-mode Multi-band Power Amplifier
Green: Gao Tong QFE1100 Envelope Tracking Power Management
Light blue: high pass PM8841 PMIC
Deep blue: high pass WCD9320 audio encoder
Finally, come to a family blessing. IFIXIT is divided into Fairphone 2's patch score into 10 points (10 points to the most easy maintenance), we have never seen such a service rating such a high service. In addition to full-fitting screens, each module can be disassembled separately, very easy to repair, it is not difficult to do itself, and the modular mobile phone name is not flexible.
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