Want to do a PCB design? Line width, line spacing rules are actually very important

1 Need to do the signal line of the impedance should be set strictly according to the line width and line spacing of the laminate. For example, a radio frequency signal (conventional 50R control), an important single-ended 50R, a differential 90R, a differential 100R, and the like can be calculated to calculate a particular line wide pitch (shown). 2 The width line of the design should consider the production process capability of the selected PCB production plant. If the design is designed, the line wide line is more than the process capacity of the PCB manufacturer of the cooperation, it is necessary to add unnecessary production costs, and the weight is caused The design cannot be produced. Generally, the line width line is controlled to 6 / 6mil, the via selects 12 mil (0.3mm), and the basic 80% of the PCB manufacturer can produce, the cost is the lowest. The wire wide line is minimized to 4 / 4mil, the via selects 8MIL (0.2mm), the basics can be produced by the PCB manufacturer, but the price is more expensive than the first case, will not be too much. The wire width line is minimized to 3.5 / 3.5mil, the via selects 8MIL (0.2mm), this time some PCB manufacturer can't produce, the price will be more expensive. The wire width line is minimized to 2 / 2mil, the via selection 4MIL (0.1mm, this time, the HDi blind buried hole design is required, and there is a laser hole). At this time, most of the PCB manufacturers can't produce, the price is the most expensive . The line wide line is set to the hole, line to the line, line to the pad, line to the via, holes to the size of the elements such as the disk. 3 Setting rules Consider the design bottleneck in the design file. If there is a 1mm BGA chip, the pin is relatively shallow, and there is only one signal line between the two rows of pins, can be set 6 / 6mil, the depth of the pin is deep, and 2 lines are required. The signal line is set to 4 / 4mil; there is 0.65mm BGA chip, which is generally set to 4 / 4mil; there is a 0.5mm BGA chip, the general line wide line distance minimum must be set to 3.5 / 3.5mil; there is 0.4mm BGA Chip, generally need to do HDI design. Generally, for the design bottleneck, the regional rules can be set (setting the method for the end of the article), and the local line wide line is set, and the other local rules of the PCB are large to produce, improve the production of PCB qualification. 4 need to be set according to the density of the PCB design, small density, loose board, can set the line wide line distance, and it is. Regular can be set according to the following steps: 1. 8 / 8mil, the via select 12 mil (0.3mm). 2. 6 / 6MIL, the via select 12 mil (0.3mm). 3. 4 / 4MIL, the via select 8 mil (0.2mm). 4. 3.5 / 3.5mil, the via select 8 mil (0.2mm). 5.3.5 / 3.5mil, the via select 4 mil (0.1mm, laser punching). 6.2 / 2MIL, via 7 mil (0.1mm, laser punch).