Shanghai January 13, 2020 - Recently, in the 2020 Global Consumer Electronics Show held in Las Vegas, Las Vegas, the Global Supply Chain and Manufacturing Company (NASDAQ: Flex) cooperates with QuickLogic and British Forte Technology Company to announce The Flexino Sensor Fusion Development Kit for rapid prototyping and the corresponding 12mm x 12mm system-level package chip is used for mass production networking equipment. To help reduce the time to market and expand the production scale, development kits and system-level package chips support a wide range of new and existing sensor fusion networked products, these products require audio, pressure and motion sensing, and Bluetooth and WiFi.
Dave Gonski Dave Gonski Dave Gonski, Vice President, Division, Division: "Flexino Sensor Fusion Development Kit and system-level package chip is designed to help the next generation and existing Internet of Things devices to market faster." Today, The major challenges facing the IoT product design is flexible to easily transition to the availability of integrated development kits for batch manufacturing. We are honored to cooperate with QuickLogic and English to launch a solution to design products from customers in different industries. "
"QuickLogic is closely working closely to integrate our EOS S3 SOC ultra low power speech and sensor processing platform with Flexino sensor fusion development kit and system level package chip," said Brian Faith, CEO of QuickLogic, "Development Kit included A sensor fusion subscriber with EOS S3 SoC, which miniaturize the same function into a separate package, which can be used for mass production. Through cooperation with Weijian and Yingfine, we can integrate the sensor Customers provide a complete seamless development path. "
"This cooperation is that in English, the advanced sensor and sensor fusion software technology makes our daily products more intelligent," "President and General Manager of the RF and Sensor Division of British Flying Ling Technology Co., Ltd. Philipp Von Schierstaedt It is said that "the development kit is combined with the digital sensor and microphone of Yingfine to make people with seamless and relaxed interactions between the next-generation networking equipment in various industries."
Flexino Sensor Fusion Development Kit
The development kit contains an ESP32 control board with Bluetooth and WiFi connection scenarios, as well as a sensor fusion subscriber that works with QuickLogic and English. The sub-board integrates QuickLogic's EOSTM S3 SOC platform, the DPS310 digital air pressure sensor and IM69D130 digital MEMS microphones, and 6-axis IMU and 64MB SPI flash.
Development kits are flexible throughout the design, compatible with AdafRuit Feather ecosystems, and optimized for rapid prototyping. Since the development kit is small, it is easy to use, and integrates the best sensor commonly used in a variety of industrial and consumer markets, therefore can be applied to many industries. It is only necessary to configure the sensor fusion algorithm by software, the same hardware configuration can be used for multiple application scenarios.
System-level encapsulation chip (SIP)
The system-level package chip is an embedded sensor fusion solution for a size-limited IoT device. The system-level package chip provides a miniaturized (12x12mm) replacement of the sensor fusion slab by Weijian Packaging Process. Separate subsystems can liberate the host processor from the permanent online sensor fusion workload. Weijian's exclusive SIP dimensions can be customized for different sensor fusion applications, and can be easily integrated into new products or existing products.
Usability
The Flexino Sensor Fusion Development Kit is now available, and the system level package (SIP) chip is scheduled to be listed in the first quarter of 2020.
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Article Source: Weijian Flex
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