The 3D NAND of the 64-story stack is crossing the flat NAN more cost-effective door, which is expected to become mainstream in the next 18 months ...
SiVA Sivaram, Executive Vice President, Western Digital, WD) Memory Technology, pointed out that the 3D NAND of the 64-story stack is more cost-effective to be more cost-effective than plane NAND.
In accesses receiving "EE Times" recently, Siva Sivaram defines 64 layers 3D NAND as a "Seminal Technology", which is expected to be applied to more than 50 product lines for WD. He expects that the WD is about half this year will use 3D NAND, 75% of which are 64 floors 3D NAND. "We think 64 floors is the most starting point for 2D NAND cost competitiveness."
WD recently released is the first client Solid State Hard Disk (SSD) created by 64-layer 3D NAND technology. WD Blue 3D NAND SATA SSD is directed for DIY players, dealers and system manufacturers, while SanDisk Ultra 3D SSD is for games and creative players who want to improve PC performance. Sivaram said that the 64-layer 3D NAN initially applied in high-order consumption equipment and will gradually expand to downstream mobile devices and embedded systems, and finally the company's application. Sivaram said: "The company will take longer to introduce." WD_NT01P1WD believed that 64-layer 3D NAN will start from high-order consumption equipment applications such as SSD and drawing intensive PC, gradually expand to a wide range of product applications
For WD, the 64-layer 3D NAN is currently cheaper than its best 2D NAND. Sivaram said: "Although not every vendor can do 64 floors 3D NAND, everyone's progress is very fast." WD has produced 48 layers 3D NAND for its retail market, but the technology is not mature The node, and the 32 layer is only internally realized. "This is a must-have learning step," he said.
He said, 15nm 2D NAND "extremely releared" miniature technology. "And when you start manufacturing 3D NAND, the line spacing will become loose, and it will not be asgens that it is asgeted as 15 nm."
However, 3D NAND is still very expensive at the point of view of the new tools required and the manufacturing technology. Sivaram said that the 64 layer is just a intersection of more than a balanced cost. "But even if it is 64 floors, 3 per unit is basically required." He said, "as long as it is properly created, it will be cheaper than other architectures."
Sivaram said that 64-layer 3D NAN has become the mainstream in the next 18 months. He and pointed out that WD has begun to provide a sample at this time last year. However, he is not willing to discuss whether the future relationship between WD and TOSHIBA will affect its 3D NAND production, and has not detailed the company's development blueprint after the company's 64-storey 3D NAND.
Objective Analysis Chief Analyst JIM Handy said that the next step of 3D NAND may be a string stack. This means that a separate 3D NAND component is stack each other, regardless of 32, 48 or 64 floors, together with a 96 or 128 stack of stacks. He said, "Theoretically, it may take a multiple of 64 floors, but it does not know what extent can be achieved."
Handy said that as the number of layers of the stack increases, the deep ratio is also the case, thus making accurate etching holes become more difficult. Sivaram said: "In addition, there are other problems, but the aspect ratio is really annoying."
String Stacking Technique can achieve a through hole having a concatenation ratio of 60, which replaces a single 120 or 240 deep than a through hole. "Everyone wants to know when to have sufficient economic benefits to transition from 3D NAND to other alternative technologies."
Since SanDisk said that RERAM will replace NAN after three generations, time has passed for nearly ten years. Handy added: "But now everyone is shipping the third generation of 3D NAND, and the fourth generation of products. 3D NAN has time longer than the original expectation." 16NM 128GB TLC plane NAND and 32-layer TLC 384GB 3D NAND Comparison (Source: Objective Analysis)
The increase in the number of layers is also faster than expected. "Especially the low-level components cannot meet the cost of the cost target, so that the number of layers increases faster. 3D NAND is that it should be cheaper than the plane, while the lower layer of components are." Handy pointed out, WD and Micron actively puts production shows, they have created profitable ways for their 3D NAND. Is Samsung to build its 3D NAND with WD, Magic light, and is not currently known.
Handy predicts about the mid-2018, 3D NAND can truly cost the cost and mass production. "Over the years, we have been thinking so. But 3D NAND still failed to achieve its cost goals, and it is still not enough to produce. It is expected to be more favorable."
In addition, Handy believes that even if the ownership of the Toshiba 3D NAND business does not change too much market appearance. "Although the name has changed, the market is still those manufacturers." In any case, WD will still use SanDisk / Toshiba technology to make flash, "The problem is to profit from it?"
Original link: https://www.eeboard.com/news/3d-nand-8/
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