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    What promotes efficient electrification of the car drive system?

     

    The automotive drive system is electrified, and high-performance semiconductor chips that meet the standard of automotive quality standards are required. Therefore, there are technical expertise in the field of power semiconductors and automotive electrons, which is a necessary condition for success in emerging electric vehicles and hybrid vehicles ((H) EV) markets. (H) The power electronics of the EV system is the main inverter, DC / DC converter, auxiliary inverter / converter, in-vehicle charger and battery management. Power module, microcontroller, drive, sensor, etc. (Figure 1) highly reliable semiconductor must support multiple inverter power levels to help achieve compact, economical, energy-saving system design. Be Figure 1: (h) Key components of the EV system: power module, high performance microcontroller and drive For example, the HybridPack family supports this design goal, which covers all power levels (10kw -150kw) for (H) EV applications. The EICEDRIVER gate-class drive is ideal for driver and control IGBT. The product family includes single / dual-channel automotive IGBT gate-class drives with high low pressure isolation capabilities and two-way signal transmission characteristics. The AURIX series such high-performance 32-bit microcontrollers are effective supplements of high energy efficient electric transmission system portfolios, and the position sensor can provide closed-loop feedback of the motor position to achieve complex control of field orientation control (FOC). Optimized gate-class drive The latest generation EICEDRIVER solution plays an important role in achieving economic practical inverter design and advancing ASIL system certification for (H) EV applications. 1edi2001AS and 1EDi2002AS targets are used to use 400V, 600V and 1200V IGBT (H) EV inverters. Both drivers have high low pressure isolation, bidirectional signal transmission, active short circuit protection, and optimized IGBT switch driver. These products have used standard SPIs for control and diagnosis, with transmission speeds up to 2MBD. Security related features include: overcurrent protection and status monitoring of all power supplies, oscillators, gate-class drive signals, and output stages. In addition, system-level diagnostics including error injection (error injection) and weak transport (WEAK TURN-ON) are also supported. Another member of the EICEDRIVER family is 1edi2010AS. This product integrates an ADC on the secondary side, which can be used to sample high-pressure bus voltages and NTC temperatures or IGBT wafer temperatures (such as wafer integrated temperature sensors). Related data is provided via SPI. 1EBN1001AE is a single channel IGBT drive energy amplifier, compatible with a 1edi20xxas series. This product is based on high performance bipolar technology, which can replace the buffer level based on discrete devices. The peak current of up to 15A can be driven and induced by its nude solder packages optimized by thermal performance. This makes it suitable for most inverter systems in automotive applications. This product has active short circuit protection and effective clamp function, which is encapsulated by bare soldering PG-DSO-14. The gate-class driver and boost combine together can save up to 20% of PCB space in a subsystem while reducing the number of discrete devices in today's solution. High performance rotor position sensor system for brushless motor control (H) EV applications often use brushless motors. These high-efficiency motors rely on fast and accurate rotor position sensors for reversing because these sensor parameters have a significant impact on the starting characteristics of the vehicle, dynamic performance, torque fluctuation and efficiency. Different principles can be utilized to detect rotor locations: rotary modulators (based on inductive) and electromagnetic. The sensor system based on the rotary transformer faces some restrictions (analog output, complex circuitry, high system cost, spatial restriction, sensitive to pseudo field, and location tolerances). The 32-bit Aurix microcontroller family generates carrier signals and performs software-based encoders by avoiding the use of rotary transformer decoding ICs to help reduce system cost by approximately 20%. On the other hand, the magnetoresistive (XMR) angle sensor with AMR (anisotropic magnetoresistance) or GMR (giant magnetoresistance) technology has high accuracy, and the positional tolerance has a low sensitivity. To implement an XMR sensor system, it is necessary to take into account the stray magnetic fields from power electronics, inductance, motor volume, cable, and motor stray magnetic fields. Infineon recently integrated the full sensor system in the motor shaft end and met all requirements. The magnetic circuit arranged around the shaft end can perfectly shield the electromagnetic interference field. This eliminates electromagnetic shielding measures that can cause system costs that have emerged. Magnetic circuits and most parts of the sensor module will completely integrate into the axis end (as shown in Figure 2), only a small portion of the sensor module mechanical structure is partially exposed to the outer side of the shaft end. Be Figure 2: The shaft end integrated sensor system ensures that it is not affected by stray magnetic fields and saves space. In terms of accuracy, the systematic assessment results are very optimistic: the maximum measurement angle error of the GMR sensor "0.3 ° (as shown in Figure 3), the AMR sensor" 0.14 °. This high-precision can remain stable in a large safe operation area, while the mid-size positional error can still achieve high precision angle measurement. Be Figure 3: TLE5309D sensor with an AMR chip and GMR chip in a package has excellent accuracy of the location tolerance In many cases, the rotor position sensor also plays a closely related role in ISO26262 functional security. Infineon offers an angle sensor with a dual-sensor package that can be integrated with two redundant sensors in a sensor. In particular, TLE5309D can meet the highest functional safety requirements by binding to the use of AMR and GMR technology, not only redundancy, but also achieve diversity. , Reading the full text, the technology area Open up the mobile phone border interaction, New Tiandi, New Tidi Technology Edge Touch Pressure Sensor Application of Air Quality VOC Detection Sensor in New Wind System Global Semiconductor OSD Sales Prospect 2017 Global sales growth is the highest Preciseley carrying MEMS debut OFC 2018 will force in Lidar MEMS 5G Herlian Electronics will appear in the 2018 Xiamen Industry Expo

     

     

     

     

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