A small E family is double-in-one new 5G mobile phone from the dismantling table. This time is Vivo's NEX3. Lifting camera, 5G plus unbounded waterfall screen. It seems that this mobile phone has incorporated this year's mobile phone all black technology. Is there anything that is not revealed in the structure? Let's take a look with Xiao E.
Configuration list
SOC: Qualcomm Snapdragon 855Plus processor, 7nm process
Screen: 6.89 inch AMOLED surface screen 丨 resolution 2256x1080 丨 Screen accounts for 92.2%
Storage: 8GB RAM + 256GB ROM
Front: front 16 million pixel camera
Back: Back 64 million pixel main camera +13 million pixel wide angle camera +13 million pixel telephoto camera
Battery: 4410 mA chip ion polymer battery
Features: Unbounded Waterfall Screen | Lift Camera | Support 5G Network
(PS: Small E gives the screen occupied by the screen visual display area ÷. The size of the machine. Screen occupancy mode is different or the official data is wrong. The battery is selected as the rated capacity labeled on the battery, and the official The typical capacity is different. If you want to know the difference between the rated capacity and the typical capacity, you can look at the previous "small e-confusion: the measured data and the official data are so different" to understand)
Dismantlement step
Take out the Catto, and the trap has a waterproof and dustproof effect on a silicone ring. Use the hot air gun to heat the back cover and the inner support gap, slowly open the rear cover, the rear cover is fixed by the adhesive.
The motherboard cover and the speaker are fixed by screws, and there is a large-area graphite sheet extending from the motherboard cover to the battery position for heat dissipation.
The motherboard cover corresponds to the metal cover at the main board BTB interface and has a bubble buffer protection. The NFC coil is fixed to the motherboard by gum.
The main sub-board is supported by the screws, and the internal support of the main board processor & memory chip is applied with heat dissipation silicone, and the inner support corresponds to the main board microphone position. Silicone ring is used for waterproof. The sub-board USB interface also has a silica gel ring with waterproofing.
The battery is supported with a lifting handle on the bilateral fixation. The inner support side stickers include the protective radio coaxial line.
The lifting camera module is still a stepped motor to achieve a lifting function, and a heat dissipation of heat dissipating silicone is applied to heat dissipation, and the main plate to the battery position is heat dissipated by a heat dissipation copper foil. The front camera module has a silicone ring with a silica gel and dustproof effect, and the button soft plate is fixed by a white plastic member.
The front camera module integrates a front camera, a handset, and a flash soft board. Internal attached soft plates are used to connect to the handset module and the flash soft board. This entire front camera includes a stepper motor, including approximately $ 11.5.
The screen is supported by the inner support. Use a heating station to separate the screen with the inner support.
Module information
The screen uses a 6.89-inch Samsung 2256x1080 resolution AMOLED surface, the model is AMB689TQ01. This screen is priced at $ 60.06.
The rear 13 megapixel telephoto camera, the model is Samsung S5K3M5, the aperture is f / 2.48.
After the 64 million pixel main camera, the model is Samsung S5kgw1, the aperture is f / 1.8.
The rear 13 megapixel wide-angle camera, the model is Samsung S5K3L6, and the aperture is f / 2.2.
The front 16 megapixel camera, the aperture is f / 2.09.
Motherboard IC information
The main IC of the motherboard (below):
1-Qorvo-QM77038A-RF power amplifier module
2-qorvo-qm77033-front-end module chip
3-QUALCOMM-PM8150B-Power Management Chip
4-Samsung-Klueg8uh08-256GB flash chip
5-Samsung-K3YH7H70AM-AGCL-8GB memory chip
6-QUALCOMM-SM8150-Qualcomm Snapdragon 855PLUS processor chip
7-QUALCOMM-SDX50M-5G baseband module
8-Qualcomm-QPM6582-RF power amplifier module
9-Qualcomm-SDR8154-radio frequency transceiver chip
The main IC on the back of the motherboard (below):
10-Qualcomm-WCN3998-WiFi / BT chip
11-QUALCOMM-QPM5650-RF power amplifier module
12-Qualcomm-PMX50-power management chip
13-QUALCOMM-PM8005-Power Management Chip
14-Qualcomm-PM8150A-power management chip
15-QUALCOMM-PM8150-Power Management Chip
16-NXP-SN100T-NFC Control Chip
17-QUALCOMM-SDR8150-radio frequency transceiver chip
The logic, Memory, PM, and RF chip information used on the motherboard are shown in the table:
The Sensor chip information used on the motherboard is shown in the following table:
Summarize
Vivo NEX 5G version uses three-segment design, the whole machine is rigorous. Multiple opening is used for waterproof. The heat dissipation is made of copper plate + graphite sheet + heat sink silicone. Heat silicone is also applied to the position of the main chip position. Since the Vivo NEX 5G version of the motherboard does not use the main board stacking, it is a little bigger than the other 5G mobile phone.
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