The 9-generation cool deer processor has released a lot of models, although Core i7-9700k added 2 cores but deleted hyperthreades. The most attractive point is the legendary "brazing process". Today, let's simply talk about this "brazing" is something. Do not say what the processor is packaged, only from the upper part, the desktop CPU will be more than one Tianling cover than the mobile CPU.
Lost the CPU covered by the sky is probably this look, the core is exposed to the outside. Although it is easy to destroy the protection of the sky, the core can directly pass the heat-fixing equipment to effectively improve the thermal conductivity.
The mobile CPU hard change to the desktop level CPU is added to the upper part of the copper cover
After all, the laptop is small, the heat dissipation effect of the heat dissipation system can be limited, and the temperature of the CPU can only be stabilized by improving thermal conductivity. The desktop processor is different, just a dozens of tower heat sinks can have a good heat dissipation effect, and because the environment where the installation process is not the same, you need a top cover to protect the core.
Although the top cover and the core surface seems to be smooth, it is not seamless to close together, and the thermal conductivity will inevitably drop. At this time, it is necessary to add fillers in both of them to make heat to the top cover from the core.
Filler between the core and the top cover
Core i7-8700k still uses silicone-lipid heat transfer
Intel has been a little disease in the past few years, is its "silicone u", which is a filler between silicone fat as a CPU core and a top cover.
As the filler with silicone is quite convenient for the manufacturing process: wipe the silicone lipid to the core, the top cover is around the glue and then fit the PCB, and then fix the glue. The disadvantage of "silicone u" only is that the thermal conductivity is not as good as metal and silicone, and the heat conductivity is further reduced.
"Brazing u" is different, using indium or 4 element elements as a filler between the core and the top cover, which has too much heat transfer efficiency than silicone. Conventional silicone thermal conductivity is typically in 10 W / mK, while the solder coefficient of soldering process is about 80 W / mK. Not only is the thermal conductivity, but also don't worry that long-term use will reduce thermal conductivity. As a DiYer, everyone is definitely hoping that Intel uses the brazing process. However, the cost of brazing is high, the process is complicated, and the INTER has not willing to give you these things in the past few years.
Brazing process
Many people may think that brazing is equipped with silicone, and it is entirely broken. Of course, some people know that the solder needs to be heated to use. However, it is not so easy to understand. We know that the top cover of the CPU is made of copper, and the core is silicon. Metal indium is the only material that can only be welded simultaneously with copper and silicon. However……
Owl radiator copper pipe and copper bottom surface
However, everyone knows how the color of pure copper is, at least, we have seen the color of the CPU top cover. This is because pure copper is easily oxidized in air, and it is also easy to corrode. Therefore, it is necessary to platen a layer of nickel metal on the surface of pure copper as a barrier layer, which is actually seen in the tower radiator.
Clearly see a golden color on the top cover
High-end tower radiator, whether copper bottom or heat pipe direct contact, is plated outside the copper material to prevent deterioration. And nickel is not well soldered to indium, so a layer of gold is also required to make a plating layer.
On the other side of the CPU core part, if indium directly welds the core, there is an opportunity to invade the inside of the core to cause damage to the CPU. In order to protect the CPU core, Intel also made a protective layer outside the core, and this protective layer is also less friendly with indium. Finally, a layer of gold is plated as a coating on the core. It is said that the bottom is solder solder in two layers.
Next, the workpiece is warmed to the solder melt and penetrates the surface of the weldment, and the welding is completed after the temperature dropped.
Why INTEL also reselects the brazing process
Welded Core i7-2600K
2 generations of Core, Intel is used to change silicone thermal inside most of the processors, with only the Supreme Series and the server processor above E5 is still using the brazing process.
The reason is actually very simple, from 3 generation to 7 generations cool Rui, the AMD can't come out and can compete with Intel, Intel is naturally every generation of squeezed toothpaste. Do not overclocking can hang the FX series, and why not care too high after the CPU overclocking.
However, the launch of the Ruilong series allowed Intel panic, first in a hurry to launch 8 generations of cool and Ryzen, then launch 9 generations cool Rui to prove its status. Core i7-9700k and Core i9-9900k, 8 core monsters, silicone can have no way to transfer heat to the top cover, so that Intel can only select the brazing process.
Speaking of the IU we can use to be brazed, I really grateful to AMD. The more interssed the intelral tissue, the more you squeeze it from 4c8t to 8C16T.
2 Brazing and silicone fat, what is the difference of silicone fat, brazing and liquid
Resolutely not advertise the e-commerce
Let's take a look at the current network merchants to buy the best liquid gold - theTHERMAL GRIZZLY CONDUCTONAUT, and its thermal conductivity is around 73W / mK, which is slightly lower than the brazing. Compared with the thermal conductivity of silicone, we can put it and the brazed thermal efficiency. This is also the material used by DiYer often used to "opening the liquid".
Safe and practical CPU open cover artifact
Before the 9-generation cool Rui launched, the products of Core I7 with K, which are both high-temperature problems, especially after overclocking, and even more than 100 ° C safety lines. Usually everyone will use a relatively advanced radiator to improve thermal efficiency, and many DiYer prefer to "open the liquid". This economically and hands-on program.
For non-brazing u, the opening process is quite simple:
1. First use the blade to connect the black gum of the connecting top and the CPU.
2. Separate the top cover and PCB securely by using the open cover artifact (own TB search).
3. Clean up the core and top of the silicone on the top cover, shave the black glue with something such as bank card.
4. Apply three anti-paint to internal contacts to prevent short circuits.
5. Apply liquid metal in the core surface.
6. Partially coated with a proper amount of black glue (the small gap is left), and the PCB is aligned, and the pressure is fixed and fixed until the black gum is solidified.
After a round of operation, even the "silicone u" of Intel's ancestors can also be shaken into a low temperature "brazing u". The price of a set of tools does not exceed 100 pieces, and the upgrade of the radiator is more expensive for the work temperature to reach the level of "opening", and the tool material is not one-time, one liquid Gold Attractions can apply 4,5 CPU cores.
Can the brazing CPU can open?
can! However, steps are more troublesome than "silicone u". Before opening the cover with the opening of the artifact, it is necessary to install the CPU and the opening artifact and heating until the solder is melted, and then the top cover is separated from the PCB.
2 generations of cool removal without warming, open cover: core directly broken
Can you open it? can! However, the core and top cover are welded together, and the core is quite brittle. It is basically equivalent to pulling the core of the outer casing directly, and this CPU is directly GG.
However, it is said that there is no heating when the new generation of Core is covered, and the core is not damaged. It is possible that this generation of Core is used by a soft brazing process, rather than 2 generations of cool-wired hard brazing processes. If it is true, it seems that we have overestimated the amount of intel's toothpaste.
Soft and brazing difference lies in the temperature, and the brazing is started for more than 450 ° C. The temperature is more advantageous for the flipite penetrating gap, the thermal conductivity is higher, but the core and top cover are firmly sticky together. Soldering can be seen as a liquid that is low in thermal conductivity, but it is definitely better than silicone.
end
It is indeed a "opening of the dust" in the country, and the temperature is also a few degrees from the previous time, which is similar to the opening of Ryzen. At this point, it seems that the liquid is still a good partner of the CPU, and friends who pursue the ultimate low temperature can also cover 9 generations of cool. However, the income of 9 generations cool and land is not as high as "silicone u", and the masters do not recommend this.
As for the 9th generation of cool, I should not start, I am a bit my own idea. Throughout the price, the 9-generation cool Rui increased frequently and the brazing process did have sufficient attractive points. Friends who have not been able to open their hands, don't have to worry about it, the CPU temperature is too high, everyone is open to overclocking 5.0GHz. With reference to the experience, 9 generations of cool concentration will slowly reduce the level of 8 generations of cool. In short, it is earlier in early buy, and it is cheaper than to buy.
However, it is not necessary to upgrade 8 generations of cool-owned friends. I really feel that it is too hot to open. 6C12T Core i7-8700K with 8C8T Core i7-9700k is really not too big, there is no need to upgrade. Of course, other words, rich small partners, one step, directly starting Core i9-9900k, experience the so-called "strongest game CPU" or ok.
Original address: https://www.eeboard.com/news/pcb-19/
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