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    Xiaomi Mix 3 disassemble: hide the front image to the slide, 孰 孰 不 给 给!

     

    "The new devices released in 18 years are working hard for a comprehensive screen. Many design manufacturers choose to hide the front camera and turn it into a sliding cover. Particularly prominent are Xiaomi mix 3 and Huawei Magic 2. This has also caused disputes among some small partners. Which is right or wrong? Xiaoe first disassembles Xiaomi mix 3 for you to see. Configuration list Before disassembly, first understand the basic configuration of Xiaomi mix 3. The configuration of the whole machine is also very excellent. In the current era of self photographing, this camera configuration must arouse many consumers. SOC: equipped with snapdragon 845 processor l 10nm LPP process Screen: 6.39 inch Samsung super AMOLED screen with resolution of 234x1080, accounting for 84.8% Storage: 6GB ram + 128GB ROM Front: Sony 24mp camera + omnivision 2MP camera Rear: Sony 12MP wide-angle camera + Samsung 12MP telephoto camera Battery: 3100mah lithium ion battery Features: magnetic power sliding cover | full screen | ceramic back cover | independent AI key | NFC and 10W wireless charging | equipped with wireless charger Module information After reading the configuration, of course, we should look at the module manufacturer's information. How can we only understand the configuration with one-sided information! Combined with the popular module information, you want to know more module information. The screen adopts Samsung 6.39-inch 2340x1080 resolution super AMOLED screen. Front 24 million Sony cameras + 2 million omnivision cameras. Rear 12 million Sony wide-angle f / 1.8 large aperture camera + 12 million Samsung telephoto camera. The fingerprint identification module is fixed with white glue, and the fingerprint identification module adopts the scheme of FPC company. Disassembly procedure Here are the super detailed disassembly steps. Absolutely let every little partner know the fun of disassembly. The complete Xiaomi mix 3 machine is removed from the rear cover. Xiaoe uses a hot-air gun to heat it to 200 degrees before removing it. After removal, it is found that the rear cover is fixed by a circle of white adhesive strips and buckles, and the fit is very high. A large area of heat dissipation graphite sheet is pasted on the rear cover as the basic heat dissipation. The ceramic back cover is provided with NFC coil, wireless charging coil and fingerprint identification soft board, which are fixed by glue. The rear end cover and speaker module inside Xiaomi mix 3 are fixed with 16 screws, and both modules are equipped with antenna contacts. The flash module is fixed in the rear camera cover. Xiaomi mix 3 battery is fixed by 2 easy pull adhesives, which is more convenient for disassembly and replacement. Then disconnect the BTB interface with tweezers and remove the main board, auxiliary board, shrapnel board, front and rear cameras and three coaxial lines. Then remove the key soft board, the soft board connecting the main and auxiliary boards, the earpiece and the vibrator. The key soft board is fixed on the inner side of the internal support through glue, the soft board is covered with silica gel sleeve, and the key is fixed through metal sheet. The screen slides through the NdFeB permanent magnet, and the slide rail is fixed by 8 cross screws. The specific components are analyzed later! Finally, remove the screen by heating it with a heating table. It's simple here. I don't need to say more about my little partner who often disassembles. Details and highlights of the whole machine The fun of disassembly is to find details. Xiao e found some. Let's talk to you first. You can leave a message to Xiaoe if you find or want Xiaoe to observe the details! 1. Detail processing The rear camera cover is fixed on the main board through screws, not generally fixed on the rear cover through glue. This design will cause the gap between the rear camera cover and the rear cover, but it also makes a solution. A circle of dust-proof foam is added around the camera position of the rear cover. 2. Motherboard heat dissipation Millet mix3 is not only pasted with gray thermal conductive silicone grease on the front and back of the main board, but also 7 pieces of blue thermal conductive silicone grease can be seen in the shield after removing the shield of the main board. 3. Magnetic power slide The magnetic power slide is realized by four neodymium iron boron permanent magnets (as shown in the red dotted line box in the figure), and the principle of attraction and repulsion of magnets is used to promote and retract. At the same time, there are five anti-static shrapnel (as shown in the yellow line frame in the figure below) and four protrusions (as shown in the blue line frame in the figure below) on the board to improve the magnetic power slide technology. The NdFeB permanent magnet is fixed on the panel through green glue. Motherboard ic information Main IC on the front of main board (as shown in the figure below): Red: qualcomm-sdm845-eight core processor + samsung-k3uh6h60am-agcj-6gb memory chip Light red: akm-ak09918-electronic compass Yellow: qualcomm-wcn3990-wifi / BT chip Light green: broadcom-bcm47755-gps chip Green: qorvo-qm78012-front end module Light blue: qualcomm-qet4100-envelope tracker Blue: STMicroelectronics gyroscope + accelerometer Magenta: nxp-pn80t-nfc control chip Purple: samsung-kludg4u1ea-b0c1-128gb flash memory chip Cyan: Qualcomm - smb1355 - fast charging 3.0 chip Brown: Qualcomm - pmi8998 - power management chip Beige: idt-p9221-wireless power receiver Pink: bosch-bmp285-air pressure sensor Main IC on the back of motherboard (as shown in the figure below): Red: Qualcomm - pm845 - power management chip Yellow: Qualcomm - pm8005 - power management chip Blue: Qualcomm - wcd9340 - audio decoding chip Green: qualcomm-sdr845-rf transceiver Purple: Knowles microphone Cyan: qorvo - qm78013 - front end module Brown: qorvo - qm75001 - front end module The use information of logic, memory, PM, and RF chips used on the motherboard is shown in the following table: See the following table for the sensor chip information used by the whole machine: Summary information The mix 3 machine is fixed with 28 cross screws, of which 8 are used to fix the slide rail device. There are 3 waterproof labels and 2 anti disassembly labels in it, which are extremely processed in terms of details and heat dissipation. The heat is dissipated through thermal conductive silicone grease, graphite sheet and copper foil. Thermal conductive silicone grease is pasted inside and outside the shield at the CPU position. Due to the addition of a slide rail between the screen and the inner support, the thickness of the whole machine is also increased. Top recommendations: NXP lpc54018 Internet of things module om40007 enables your solution to land faster Texas Instruments msp-exp430fr2355 launchpad development kit makes design and development simple and intuitive Microchip technology sr087 power supply demonstration board, a new choice of switching power supply Bosch bmi088 high performance IMU works with you to improve the flight and navigation experience Roma semiconductor sensorshield-evk-003 Evaluation Kit, a board with "seed and material" Intel realsense depth camera D400 series "more convenient secret" is waiting for you to find out Analog devices eval-adxl362 evaluation board gives developers and designers more choices Cypress Semiconductor psoc6 ble development kit, beautiful design is about to happen STMicroelectronics vl53l1x time of flight ranging sensor, absolute ranging without fear of color and reflection NXP i.MX 8mguad Evaluation Kit mcimx8m-evk is a high-performance development tool out of the box Infineon im69d120 and im69d130 xensiv MEMS microphones are designed for low distortion and high signal-to-noise ratio Original address: https://www.eeboard.com/news/mix-3-10/ Search aiban.com and pay more attention. You can master the latest development board, intelligent hardware, open source hardware, activities and other information every day. Recommend attention! [wechat scanning can be followed directly]“

     

     

     

     

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