With an ASIC grade architecture and ASIC enhanced design, including 44 million logic units, the industry's maximum capacity device. Detailed device selection tables, product technical documents, design tools, and methods supported by Kintex Mid-End and Virtex high-end 20nm UltraScale series
All Programmable FPGA, SOC and 3D IC Global Leading Corporation (Xilinx, Inc. (NASDAQ: XLNX) today announced its 20nm All Programmable UltraScale (TM) product line, and provides related product technical documents and Vivado R) design kit support. Following the first 20nm chip in early delivery industry in November 2013, Saulith continued to actively promote the delivery process of its UltraScale device. These devices use the industry's unique ASIC grade programmable architecture and the Vivado ASIC enhancement design kit and Ultrafast (TM) design method to provide comparable ASIC-level performance advantages.
The new Sailive UltraScale product line uses the UltraScale architecture and the TSMC (TSMC) super high door density 20SOC process technology, further expanding the market leading Kintex (R), Virtex (R) FPGA and 3D IC product range camp. The UltraScale device is relatively available for the currently available solutions, and the system performance and integration have increased by 1.5 to 2 times, and the power consumption is more than 50%. These devices provide a new generation of wiring schemes, similar to the ASIC clock function, and logical and architectural enhancements, which not only eliminates the interconnected bottleneck problem, but also ensures more than 90% of the stable device utilization without sacrificing performance.
President of Xilinx, CEO Moshe Gavrielov, said: "Saili continues to lead technology innovation, and take the lead in launching breakthrough innovation products to help designers have the fastest listing speed. Combine our UltraScale ASIC architecture, Vivado ASIC enhancements Design kit and Ultrafast method, UltraScale devices can compare the ASIC-level feature. The strong combination of the above chip and design provides a shortcut to help customers achieve obvious system differentiation, and become ASIC and ASSP absolute Acounting technology.
Dr. Tiesi Company and Dr. Liu Deyin, a joint Executive, said: "Tumeri Company has promoted the development and construction of many new technologies and design methods. With the first 20nm UltraScale architecture product, Tyling thought. Let us jointly demonstrate how to use chip process capacity and assembly architecture to create maximum effectiveness and system value for products.
Dr. Liu Dynasty, General Manager of TSMC (TSMC) said: "We cooperate with Xilinx to develop and deploy many new technologies and new methods. With the first 20nm UltraScale architecture products Introducing, Xilinx and Taizhou Company also showcase how to use the synergy between chip technology and device architecture to exert the maximum performance of the product and achieve the highest system value. "
Kintex UltraScale series
Latest Kintex (R) UltraScale (TM) FPGA has up to 116 million logical units, 5,520 optimized DSP SLICE, 76MB BRAM, 16.3Gbps backplane transceiver, PCIe (R) Gen3 hard module, 100GB / S integrated Ethernet Mac and 150GB / s Interlaken IP core, and DDR4 memory interface. The Kintex device initially launched as a member of the Saulith 28nm 7 Series has now become the most powerful and cost-effective benchmark products in mid-range products. The Kintex UltraScale device is designed to continue to maintain the leading position in this mid-end product market to meet the needs of the increasingly expanding core applications, such as:
- 8K / 4K ultra HD visual display and equipment
- 256 channel ultrasound
- 8X8 mixed mode LTE and WCDMA radio with intelligent beamforming function
- 100G Traffic Management / NIC
- DOCSIS 3.1 CMTS equipment
Virtex UltraScale Series
The latest Virtex (R) UltraScale (TM) can achieve unprecedented high performance, system integration, and bandwidth in a single chip, and set new benchmarks for the industry. As the maximum device in this series, Virtex UltraScale has 4.4 million logic units, 1,456 users I / O, 48 16.3GB / S backplane transceivers and 89MB BRAM, which has reached the maximum capacity of Saili industry Virtex- 7 times more than the 72,000T device, break the industry record again. In addition, the product also provides an amazing 50 million ASIC equivalence. The Virtex UltraScale device is included in the DDR4 memory interface in addition to the integrated PCIe Gen3, 100Gb / s Ethernet Mac and 150GB / S Interlaken IP, and there is a built-in 28Gb / s backplane transceiver and 33Gb / s chip to fiber transceiver. To achieve hundreds of GB / S level system performance in order to utilize intelligent processing functions at full line rate.
Due to ultra-high system performance and capacity, the Virtex UltraScale series has become an ideal choice for a variety of challenging applications, such as:
- Single-chip 400g Muxsar
- 400G repeater
- 400g Mac-to-Interlaken Bridge Bridge
- Simulation and prototype design
The entire UltraScale (TM) series of Sauli uses the same performance logical architecture and key architecture modules to create the best scalable architecture. In addition, the Kintex UltraScale FPGA can smoothly transplant to Virtex UltraScale due to pin compatibility between the series products. If you need to understand how to evaluate the new UltraScale product, please refer to the following customer testimony.
Customer testimony
"Aliathon is a member of the Saulith League, providing the cutting-edge OTN IP solution, and uses 4 27.95G optical transceivers in the Sailive 7 Series FPGA to demonstrate 100G OTL4.4 technology .ultraScale (TM) architecture and Characteristic Issue We can meet a new generation of optical requirements. We actively introduced our IP product portfolio into the ULTRASCALE in Xilinx, in order to provide integrated solutions for our common customers. "
Alan McDADE, Aliathon Business Director
"Alpha Data is very willing to adopt a solution based on the latest ULTRASCALE (TM) devices based on Sauli. Our new generation of rugged embedded and data center development boards will have unprecedented high-throughput speed and high performance. Curing PCIe R) UltraScale enhancements such as Gen3 and 100G EMAC modules can create the most advanced solutions and will not reduce energy efficiency. "
Be
ADAM Smith, Alpha Data CEO
"ADI's high-speed data converter combines Xilinx's Ultrascale (TM) FPGA platform to create an attractive solution to significantly simplify the application of signal processing solutions. ADI provides a complete reference for UltraScale Design, including hardware, software, HDL, schematic, driver, and high-speed data acquisition, motor control, SDR, JESD204B, and high speed converters. "
Emre Onder, ANALOG DEVICES company marketing vice president
"As a member of the Senlin Senior Design Service Alliance, FIDUS constantly fought in the technical frontier, helping OEM customers accelerate new product development processes. The UltraScale (TM) architecture of Xilinx's UltraScale (TM) and Vivado (R) have left us extremely profound. The impression also brings us a huge business opportunity to our customers, helping them use this technology to launch unique advanced systems for wired communications, aerospace and defense, test measurement, and broadcast videos. As The participants of the early trial plan of the ULTRASCALE, FIDUS will launch a JESD204B prototype design when listed on the ULTRASCALE platform. "
John Bobyn, Fidus Systems Vice President
"Helion has long been a member of the Saulith Federation, providing highly optimized cryptographic technology and lossless compression IP for the global customers of Saulith. We are very impressed by the ULTRASCALE (TM) architecture of Xilinx. Especially the latest architecture Sexuality allows us to operate with a higher data rate and take up less FPGA resources. Helion is committed to extensively introducing the IP core based on the Xilinx UltraScale architecture in early 2014. "
Graeme Durant, Heleion Technology CEO
"Thanks to the performance improvement of Ultrascale (TM), INTOPIX can introduce a minimal UHDTV 4K / 8K JPEG2000 IP core. UltraScale's low-power architecture combines the latest intopix TiCO ultra-light visual lossless compression technology to support IP high quality video Perfect solution for efficient transmission. "
Gael Rouvroy, INTOPIX CTO
"As a member of the Sublim Senior IP Alliance, Northwest Logic cooperates closely with Xilinx to develop connectivity solutions for the global OEM customers in Singer. The latest clock architecture is especially impressive, and we value very much, you can Easily migrate our IP from Kintex (R) UltraScale (TM) to Virtex (r) UltraScale, which uses the same high performance architecture .Northwest Logic has begun to launch the DMA kernel and other IP cores based on the UltraScale architecture of the Saulithi Ultrascale architecture. It can be integrated with the Vivado IP Integrator process; at the same time, we look forward to working with Saulith to cooperate. "
President of Brian daellenbach, Northwest Logic
"Tokyo Electronic Device Co., Ltd. (TED), UltraScale (TM) FPGA is a perfect solution for high performance applications, such as 8k4K video, such applications require enhanced logic blocks, high performance architecture, 100G EMAC, DDR4 memory Support and other advanced features of this new 20nm platform. TED as a member of the Sublims Senior Union will introduce the UltraScale FPGA development platform including DisplayPort 1.2, 6 / 12g-SDI and other FMC interface cards and VxONE development platforms to help us together Customers improve design productivity. "
Vice President of Yasuo Hatsumi, Vice President of Tokyo Electronic Device Co., Ltd. and General Manager of EC Product Department
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