iPhone 11 Pro Max Bom Exposure: So profiting is really fascinating

The so-called detailed BOM BOM refers to a product! Recently, analysts Techinsights Apple iPhone 11 Pro Max was disassembled to obtain a complete list of materials and analyzes its overall BOM cost. SoC aspects, Techinsights dismantling this number inside the Apple iPhone 11 Pro Max A13 processor is APL1W85. The processor A13 and Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM packaged together by PoP package. A13 size processor (mold sealing edge) of 10.67mm x 9.23mm = 98.48 mm². In contrast, the processor of the area A12 9.89 × 8.42 = 83.27 square millimeters, thus increasing the area A13 18.27%. The baseband aspect, Intel PMB9960, the modem may be XMM7660. According to Intel, XMM7660 is the sixth generation to meet the 3GPP Release 14 LTE modem. It supports up to 1.6 Gbps in the downlink speed (Cat 19), the supporting rate up to 150 Mbps in the uplink. In contrast, the previous generation Apple iPhone Xs Max uses the Intel PMB9955 XMM7560 each modem can support 1Gbps speed downlink and uplink rate of 225Mbps. The following is a list of the material analyzed Techinsights: RF transceiver Intel PMB5765, an RF transceiver and a baseband chip of Intel. Nand Flash memory: using a Toshiba 512 GB NAND flash memory modules. Wi-Fi / BT module: using Murata 339S00647 module. NFC: NXP's new SN200 NFC & SE module, and SN100 last used iPhone Xs / Xs Max / XR different. PMIC: Intel PMB6840, Apple 343S00355 (APL1092), this should be Apple's own design for the main A13 bionic processor PMIC DC / DC: Apple 338S00510, Texas Instruments TPS61280 Battery Charge Management: STMicroelectronics STB601, TI SN2611A0 Display Power Management: Samsung S2DOS23 Audio IC: Apple / Cirrus Logic 338S00509 audio codec and audio amplifier 338S00411 three. Envelope Tracker: using Qorvo QM81013 RF front-end: Avago (Broadcom) AFEM-8100 front-end module, Skyworks SKY78221-17 front end module, Skyworks SKY78223-17 front end module, Skyworks SKY13797-19 PAM etc. Wireless charging: STMicroelectronics of STPMB0 chip, probably the IC is a wireless charging receiver, employed in the previous iPhone is Broadcom chip. Camera: Sony is still the supplier of iPhone 11 Pro Max four visual camera. STMicroelectronics (STMicroelectronics) third consecutive years, the global shutter infrared (shutter IR) camera chip as the iPhone FaceID detector system based on the structured light. Other: STMicroelectronics ST33G1M2 MCU, NXP CBTL1612A1 display port multiplexer, Cypress CYPD2104 USB Type-C port controller. Overall: iPhone 11 Pro Max (512GB version) of the material BOM cost of $ 490.5, or about 3493 yuan, less than its country line version priced 12,699 yuan 1/3. It should be noted that the material cost refers to the cost of each component, not even counting the cost of research and development operations, and the like.