On September 13, 2018 Beijing, at 1:00 am (US local time on September 12), on September 12th, on September 12th, the iPhoneXS, iPhone XS Max and iPhone XR and smart watch Apple Watch Series 4 were released in Apple.
The iPhone XS National Bank only supports single card, other regions support single-solid SIM + ESIM. The iPhone XS shape and configuration is not changed in the upper generation of iPhone X: cancelling fingerprint recognition, using a face recognition plan; with the OLED screen with Liu Hai; L-type battery and double-layer motherboard, support wireless charging and fast charge. Compared to Phone X IP67 dust-proof waterproof, this increase, reaching IP68 dustproof waterproof.
Configuration list
SOC: A12 Bionic processor 7nm LPP process
Screen: 5.8 inch Samsung AMOLED screen 丨 resolution 2436x1125
Storage: 4GB RAM + 64GB ROM
Front: 7MP camera + infrared camera
Rear: 12MP + 12MP double camera
Battery: 2658mAh lithium-ion battery
Features: Double-layer motherboard | dot array projector | IP68 dustproof waterproof
Dismantlement step
As always, since the screen starts, due to the dustproof waterproof, screen and back cover, the black waterproof strip of the two plum screws and the rear cover is fixed. After opening the screen, you should unless the screw and remove the metal cover of the fixed screen cable. Otherwise, it is directly hard, and it is estimated that the cable is dangerous.
A large black waterproof strip can be seen on the back cover step.
The handset module is fixed on the back of the screen by screws, and a large number of sensor devices are integrated on the earpiece module.
And we accidentally discovered the NFC coil on the back of the colors.
The rear camera is fixed by a metal cover, and the metal cover is fixed to the back cover by a screw. After the metal cover of the fixed screen cable is removed, the various cable interfaces that are slippery will be opened directly. Then screwing the screws of the fixed motherboard, and take the motherboard smoothly.
The motherboard is used as a double sheet, and the total thickness of the double sheet is 3.8 mm.
In terms of the connector, both the motherboard BTB interface uses foam protection, and 3 groups are used on the antenna components, which adds a metal strip in the middle than other BTB connectors.
Two motherboards are connected by solder joints, and the solder joints are melted by the hot air gun.
The heat dissipation of the double-layer motherboard is inevitably, so there is heat-dissipating graphite on both sides of the motherboard.
Since the A12 processor is located between the two motherboards, the conditions in heat dissipation are naturally severe. Therefore, in the A12 chip, we can see a large amount of thermally conductive silicone is used for heat dissipation.
The vibrator and speaker module are fixed at the bottom of the phone and secured by screws.
The battery does not seem to be two batteries that are used in iPhone X. Instead, a piece of L-type battery is used directly, and the capacity is 2658mAh, which is fixed to the back cover by 4 easy pull gels, which is convenient for disassembly.
The front camera module is connected to the motherboard.
Since the camera module includes a front camera, an infrared camera, and a dot array projector, all components are fixed together by a metal strip.
The last step is removed by the volume key soft plate, the power button soft plate, antenna module, and the wireless charging coil.
The volume key soft plate and the wireless charging coil are not connected through the interface, but is connected by solder joints.
Motherboard component analysis
There is less shield used by the motherboard, and the BTB connector layout is more concentrated, and the lower area is larger, the main board is a single-panel, and a large number of RF chips are integrated under the card slot.
The main IC of the motherboard (below):
Be
● TOSHIBA-TSB3243ST3415TWNA1-64GB flash memory
● NXP-CBTL1612-Display Port Multiplexer
● 338S00248-audio decoding chip
● 2 SkyWorks-GPS low noise amplifier
● 4 different models of SkyWorks-power amplifiers
● 2 Murata-4x4 MIMO duplexers
● Broadcom-bcm59355-wireless charging chip
● Intel-PMB99550-baseband processor
● USI-339S00551-WiFi / BT chip
● NXP-100VB27-NFC control chip
● Intel-radio frequency transceiver
● AVAGO-high / medium frequency power amplifier duplexer
The main IC on the back of the motherboard (below):
Be
● 338S00375-power management chip
● STMICROELECTRONICS-STB601A0-Power Management Chip
● 3 338S00411-audio amplifier
● Apple-APL1W81-A12 Bionic processor + 4GB memory chip
● 338S00383-A0-power management chip
● TI-SN2600B1-battery charging chip
Last place part of the part:
The use of logic, memory, pm, rf and MEMS chip used on the motherboard is shown in the table:
Be
Summarize
iPhone XS machine uses 57 screws to fix, high internal modularity, integrated floodlights, proximity sensors, rays sensors, and microphones; front camera, infrared camera, dot array projector assembled through metal strips Together. In terms of heat dissipation: The front and reverse surface of the double plate has a graphite film, and there is a thermally conductive silicone on the internal A12 processor. Waterproof: The screen is black-colored waterproof at the back cover connection; the speaker is moving with the Lightning Connector interface, and the SIM Cardo is waterproof. The chip is mostly a SIP package.
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