COB package introduction
COB packaging topic chip package (Chips On Board, Cob) is to solve the technology of LED heat dissipation. Compared with the in-line and SMD, it is characterized by saving space, simplifies the package job, and has an efficient thermal management method.
The COB package is Chip On Board, which is to attach a bare chip to the interconnect substrate with a conductive or non-conductive adhesive adhesive, and then conduct its electrical connection. If the bare chip is exposed directly in the air, it is easily contaminated or artificially damaged, influenced or destroyed the chip function, so that the chip and the bond lead are encapsulated by the gel. This package is also called a soft package.
The COB package is Chip On Board, which is attached to the interconnected substrate with a conductive or non-conductive adhesive adhesion, and then conducts its electrical connection.
If the bare chip is exposed directly in the air, it is easily contaminated or artificially damaged, influenced or destroyed the chip function, so that the chip and the bond lead are encapsulated by the gel. This package is also called a soft package.
Analysis of LED Failure in COB Package
Although the LED chip theoretical life can reach 100000H, due to the influence of packaging, driving, heat dissipation, the light source or lamp life of ordinary lighting is only 30000h, even in the market, there are many years for less than half a year. Will you have problems. How to improve the reliability of LED lighting products has always been a problem that companies need to solve.
LED lighting product failure mode can generally be divided into: chip failure, failure, electric stress failure, thermal stress failure, assembly failure. With the analysis and improvement of these failure phenomena, we can help us design and produce high-reliability LED lighting products.
COB-based LED product characteristics
LED lighting products consist of three major components, namely heat dissipating structural parts, drive power and lighting parts. The illumination part consists of a light source and a secondary optical lighting assembly (such as lens, mirror, and diffusion plate), and the typical application model is shown in Figure 1. As the light source part of the LED lighting product is the core component, which is an underlying device for optoelectronic performance. Based on COB technology is a package form of the light source, itself no longer requires any automatic surface mount process, only need to simply lead the positive electrode to the matrix or lighting. As shown in Figure 1 shows its key components in LED lighting products. These components are, especially COBs in most cases, are manually assembled. This causes it to produce more potential faults than in an automated process. , Reading the full text, the technology area
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