Ann Many Semiconductor cooperates with the TELEDYNE IMAGING SENSORS to create an ultra-large engagement point reading integrated circuit (ELS ROIC) for astronomical research. TELEDYNE's H4RG-15 image sensor is the latest generation of results for 20 years of development activities, funded by the National Science Foundation (NSF), NASA and TELEDYNE, which is intended to develop for astronomy A larger stronger infrared sensor for research.
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The 1,6 million pixel H4RG-15 contains TELEDYNE mixed into the CMOS reading circuit, which is the maximum sensor manufactured in infrared astronomical applications in the history. One enable technology for developing H4RG-15 is a CMOS reading integrated circuit (ROIC) of 63 mm x 63 mm engagement points using 180 NM process techniques proprietary with Ansian Semiconductors. This ROIC size is so large that one 200 mm wafer can only accommodate 4 ROIC die.
These ELS ROICs can be attributed to the "Myster Beauty Semiconductor Wafer manufacturing team and the company's custom wafer foundry segment". HR4G-15 reads ROIC in Anshairi Semiconductor, the Walan manufacturing plant of Oregon Gresham, Oregon. The Ansian Semiconductor Borrowing project exhibits the company's successfully producing the H4RG-15 image sensor required for the next-generation sensor requirements.
H4RG-15 has been set up in Mauna Kea Observations at the University of Hawaii, USA to confirm the performance of this sensor under telescope observations. Dr. Donald Hall, Chief Scientist, which was held by NSF funded by NSF, said: "Using this new sensor system can capture the resolution of images, it is important step by infrared astronomical observation forward development."
The H4RG-15 is the latest generation of the extremely successful HXRG series image sensor developed by TELEDYNE for the leading ground and space astronomical observatory, including Hubble Space Telescope, James Weber Space Telescope and major Ground Observations.
TELEDYNE H4RG-15 Senior Project Manager Richard Blank said: "H4RG-15 is critical to the next generation of ground telescope. In the future, H4RG-15 will be used to design 30 meters long telescope (ELT) and future space tasks."
TELEDYNE IMAGING SENSORS Space and Astronomical Vice President James Beletic said: "We attach great importance to cooperation with Ansian Semiconductors, this cooperation is critical to the successful development of H4RG-15."
ANANM SSD operators managers managers: "The success of H4RG-15 ROIC has been proved to confirm our company's wafer genetic business capabilities and CMOS imaging process capabilities. H4RG produced by TELEDYNE IMAGING SENSORS -15 ROIC is one of the largest CMOS chips ever. The innovative engagement process adopted by Anshen American semiconductor for this project, so that we can develop smaller build modules to produce a larger sensor. This project highlights Anshen Semiconductor It is possible to meet the broadness and depth of the technical capabilities provided by the market, which can meet even the most stringent application requirements. "Read the full text, technology area
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