The price of 6199 first Huawei 5G mobile phone Mate 20 x, cost estimates $ 400.53.
I have been paying attention to Ewistech's small partners know that the recent small E has included 3 5G mobile phones. Huawei's first 5G mobile phone MATE 20 X naturally does not carefully disassemble the analysis, then in 2214 components of Huawei, the most components are available. Which country is the country? What is the main thing?
Configure
First review the foundation configuration, Xiao E purchased the MATE 20 x 5G.
SOC: Haisi Kirin 980 processor 丨 7nm process
Screen: 7.2 inch Samsung Super AMOLED screen 丨 resolution 2244x1080 丨 screen accounts for 87.4%
Storage: 8GB RAM + 256 ROM 丨 Maximum Support 256GB NM card expansion
Front: 24MP
Back: 40MP wide angle + 20MP super wide angle + 8MP telephoto
Battery: 4100mAH lithium polymer battery
Features: IP53 dustproof waterproof | 40W fast charge | Ba Long 5000 baseband | support Huawei handwritten pen | back fingerprint recognition
Here, it also shows that the equipment disassembled by Ewistech is purchased through market channels, and each product may be made by different suppliers, we are subject to the machine purchased. In the component analysis process, it is possible to encounter unrecognizable situations. Cost estimates are Ewistech Subssence to determine the addition of market research to make a correction, so the cost estimate of the metader is for reference only, but there are many factors affecting the cost of components, and there is a certain difference in real cost.
Dismantle
First remove the tray and glass rear cover, the adhesive adhesiveness of the fixed glass rear cover is weaker, and after the hot air is softened, it can be opened.
Carto has a waterproof rubber ring. After removing the opening, you can see 6 test points on the motherboard for detection and repair equipment.
There is a large-scale blur cotton on the back cover, which can play a certain buffer. The fingerprint recognition module and the rear camera cover are fixed through the glue.
The top antenna module and the bottom speaker module are secured. It has a film waterproof on the speaker. The NFC coil is fixed to the antenna module using a glue, and a large area graphite paste is posted on the back.
Then, the motherboard, panel, front and rear cameras, laser focus soft plates, and connect fingerprints to identify the soft board and 2 coaxial lines of the motherboard. The rear camera soft board BTB interface is fixed by a metal plate.
When the chip is disassembled, it is found that not only the motherboard shield is coated with a heat-conductive silicone, and the inner side of the shield is also coated with heat conductive silicone.
The laser focus chip, color temperature sensor and flash are integrated on the soft board.
Remove the battery, light / distance sensor soft board and vibrator, the battery is fixed through the easy pull handle to facilitate disassembly. When dismantling the button, you should pay attention to the first black part to remove the button.
Finally, the screen is heated to a certain temperature, i.e., the screen is separated from the inner support, and the internal stone ink is supported under a hot brass tube.
The whole machine uses 24 screws to fix, which uses the upper and lower stacks to save space. The screw is labeled, and the inner is only used in the SIM calorker and the speaker, and the heat dissipation is mainly heat dissipated by copper-tube liquid cooling and graphite sheet. It is also the first time to see the non-double board design on the 5G mobile phone, the motherboard is under large space.
Component analysis
After the EWSETECS search comparison analysis, in 2214 components of the MATE 20 x 5G, Japan provides 2006 components, mainly for devices, although the number of components is the highest, but the cost is only 8.3% of the overall; and the cost is the highest. Up to 43.2% of China, a total of 140 components, mainly IC and non-electronic devices. Second, there is only 6 components of the flash memory, screen and camera sensors, with only 6 components, and the cost ratio reaches 41.3%.
What is the unit price TOP 5?
How can component analysis IC? Let's take a look at what major ICs on the motherboard:
1: hisilicon-hi3680-unicorn 980 eight-core processor
2: SKHYNIX - H9HKNNNFBMAU-DRNEH - 8GB of memory
3: Micron-3GB memory
4: hisilicon-hi9500-Ba Long 5000 baseband chip
5: Samsung-Klueg8u1ea-B0C1-256GB flash chip
6: 2 hisilicon-hi6422-power management chip
7: Hisilicon-Hi6403-audio decoding chip
8: NXP-PN80T-NFC control chip
9: BOSCH-BMP380-Pneumatometer
10: STMicroelectronics-LSM6DSM-Gyro + Accelerometer
The main IC on the back of the motherboard:
1: hisilicon-hi6365-radio frequency transceiver chip
2: hisilicon-hi1103-wifi / bt chip
3: 2 hisilicon-hi6421-power management chip
4: Goertek-Microphone
5: AKM-AK09918C-Electronic compass
The MEMS chip information used in the whole machine is also sorted out!
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Source: ewistech
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