The big screen's Apple mobile phone has been looking forward to a long time, and Apple launched two large size 4.7 "iPhone6 and 5.5" iPhone6 Plus to meet all your requirements. Apple has also released two mobile phones for different users last year. This year, this year may also be based on the same consideration. Generally, the iPhone6 Plus, which may be more popular in Asia. On the day after the launch conference, the well-known dismantling website ifixit made detailed dismantling, let's take a look at the 5.5 "iPhone6 Plus.
The main parameters of iPhone6 Plus:
Apple 64-bit architecture A8 chip
Second generation M8 sports association processor
3 kinds of 16, 64, or 128GB internal capacity
5.5 inch 1920 x 1080 Resolution (401 PPI) Retina HD HD display
8 megapixel ISIGHT camera (with 1.5 micron pixels, Focus Pixels autofocus, and optical image anti-jitter function) and 1.5 megapixel Facetime camera
Touch ID fingerprint recognition sensor, air pressure gauge, three-axis gyroscope, accelerator sensor, and ambient light sensor on the main screen button
802.11a / b / g / n / ac Wi-Fi + Bluetooth 4.0 + NFC + 20-Band LTE
iPhone6 Plus is the thinnest apple phone with a thickness of only 7.1mm, a size of 158.1mm x 77.8mm.
Just like the iPhone 5s, iPhone 6 Plus has three different colors to choose: silver, gold, and space ash. The most illness is "protruding" camera, although the lens cover is sapphire glass. The iPhone 6 Plus uses a full metal casing, but there are two plastic antennas for wireless signaling on the housing.
The dismantling of the screen is simple, no hot air gun is required.
The internal layout and iPhone5S are very similar, but the battery is large. (Next)
First remove the HOME button of the front panel, there is a metal bracket support.
Next, remove the front camera, here there is a whole cable assembly, but also a headset speaker.
The metal plate of the front panel assembly is now available.
iPhone6 Plus's battery capacity is large and reaches 2915mAh.
The battery has a total of 3.82 volts and 11.1 watts of energy, with a total of 2915 mA, nearly double the capacity than iPhone 5S (1560 mA). Apple claims to be 24 hours in 3G, and 384 hours standby time. (Next)
There is a special vibrator on the right side of the battery, and inside some copper coils.
Next, remove the rear camera first.
The camera has always been the technology that Apple is proud. Like iPhone5s, iPhone6 Plus has an 8 megapixel and F / 2.2 aperture back camera. iPhone6 Plus has added two functions: optical image anti-jitter function, and "Focus Pixel" autofocus.
Remove the metal housing of the camera (next page)
Iphone6 Plus's unique camera optical image anti-jittering function: The lens element is nestled into a tiny metal cage on the left side, and is gently pushed around the electromagnetic coil around the right side sensor. The gyroscope and the M8 exercise association processor continue to transmit the IPHONE 6 PLUS jitter data to compensate for quick moving lens components. Therefore, you can take a sharper, clear photos, even in a low-light environment.
Let's take a look at the core motherboard of iPhone6 Plus.
Closeup of a8 processor
Some IC devices on the front of the motherboard:
Red Apple A8 APL1011 SOC + ELPIDA 1 GB LPDDR3 RAM (EDF8164A3PM-GD-F)
Orange QUALCOMM MDM9625M LTE MODEM
Yellow Skyworks 77802-23 Low Band LTE PAD
Green avago a8020 high band pad
Blue Avago A8010 Ultra High Band Pa + FBARS
Purple Triquint TQF6410 3G Edge Power Amplifier Module
Black InvenSense MP67B 6-AXIS GYROSCOPE AND Accelerometer Combo
Other partial ICs on the front of the motherboard:
Red Qualcomm QFE1000 Envelope Tracking IC
Orange RFMD RF5159 Antenna Switch Module
Yellow Skyworks 77356-8 Mid-Band Pad (next page)
Some IC devices on the back of the motherboard:
Red SK HYNIX H2JTDG8UD1BMS 128 GB (16 GB) NAND FLASH
Orange Murata 339S0228 WiFi Module
Yellow Apple / Dialog 338S1251-AZ Power Management IC
Green Broadcom BCM5976 TouchScreen Controller
Blue NXP LPC18B1UK ARM CORTEX-M3 MicroControllers (M8 Sports Association)
Purple NXP 65V10 NFC Module + Secure Element (It is likely to integrate NXP PN544 NFC controller)
Black Qualcomm Wtr1625L RF Transceiver
The other IC on the back of the motherboard:
Red Qualcomm WFR1620 RECEIVE-ONLY COMPANON CHIP
Orange QUALCOMM PM8019 Power Management IC
Yellow Texas Instruments 343S0694 Touch Transmitter
Green ams as3923 boosted nfc tag front end
Blue Cirrus Logic 338S1201 Audio Codec
After reading a complex motherboard, remove the unique speaker module in your phone.
The iPhone6 Plus headphone jack and data line interface are integrated in the same cable assembly.
There are very many antennas on the rear housing, which can be understood that there are too many types of integrated wireless transmission.
The power button of the iPhone6 Plus moves to the right side of the phone, and the volume key in a cable assembly.
The new power button is very characteristic, and the waterproof and dustproof effect is good.
Finally, look at the family blessings.
summary:
Apple mobile phone is getting better and better, iPhone6 PLUS battery capacity increases, thus, although the screen is increased, the call and standby time are longer. iPhone6 PLUS camera unique optical image anti-jitter function, increasing NFC. Through dismantling, especially internal motherboard integration, and antenna layout, it can be seen that although iPhone6 Plus is not particularly innovative, it can be said that a product of a collection of mobile phone is designed.
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