OPPO A55 is a thousand yuan entry-level 5G mobile phones issued by OPPO. So the association of the United Arab Sector + Large-capacity Battery + 128GB flash + large display is available for daily use. So how is the cost of such a price of 5G mobile phones?
Dismantlement step
A55 Catto adopts a three-card design, supporting two 5G nano-SIM card dual standby and a microSD card with a maximum capacity of 1TB. Carto is a plastic material, and there is no waterproof design, and the surface is identified to prevent misinterping.
The rear cover is a soft PC material, and the foam glue is fixed with a foam. A graphite heat dissipation material and a foam buffer material is attached to the inside of the rear cover to assist the whole machine heat dissipation and support the rear cover to prevent over-squeezing rear cover from being damaged by the battery.
Open the back cover, see familiar conventional three-stage layout structure, a total of 20 cross screws are used for fixed. The top surface of the rear end is attached to a graphite heat sink, and the bottom 1 fixed screw surface is attached to the OPPO word.
The A55 rear end cover and the inner support are fixed, and the lens is removed. When removing, it is necessary to pay attention to the BTB interface between the right fingerprint identification soft board and the motherboard is a connection state. After disconnect, the entire rear end cover is removed. At the same time, you can remove the fingerprint identifier and volume buttons on the rear end cover.
The volume button is a plastic material.
The rear end cover is a PC material, and there is an FPC antenna at the top and bottom, and the rear camera cover cannot be removed separately.
On the motherboard, we can see that the rear three cameras are separate camera modules, and the front camera has a layer of graphite cooling stickers, and the metal shield surface has a heat dissipation copper foil.
The battery is fixed with a relatively common plastic tape, which is convenient for dismantling.
Disconnect the BTB interface between the motherboard and the sub-board, remove the motherboard and speaker module. The front shield surface of the motherboard is attached to the heat-dissipating copper foil, and the main IC position is coated with gray thermally conductive silicone between the inner support. The speaker and the sub-board are connected to the contact connection through the FPC soft board. 1217 speaker unit, module is provided by AAC Rui Sheng Technology.
After removing the speaker module, you can see that the installed bit has a circle of foams to buffering the buffer, the one-plate USB interface and the 3.5mm earphone hole are covered with silica gel.
Two coaxial cards are fixed by the bubble fixation, and the layout is clear.
Bottom panel, main panel connection soft board and coaxial line, the back side of the sub-board is increasing.
Top receiver modules, vibrators, speaker soft boards, power keys and volume key soft plates are supported by glue fixation.
Finally, the screen is heated by the heating station to separate the screen and the inner support, and the front surface is attached to the large-area graphite sheet for heat dissipation.
Finally, the 4 separate cameras are removed, and the main board BTB connector has a silica gel ring.
Disassemble summary
The OPPO A55 machine appearance uses a 3D thin design, the vacuum coating brightening of the back cover, which is more attractive. Copper foil is used inside the whole machine, and the graphite sheet plus thermosilica fat material is heat dissipation of the whole machine.
Detail highlight
Since the A55 is selected, the chip and devices on the motherboard are less, the motherboard layout is not so compact, so the SIM card slot is placed on the motherboard. The front and negative circulatory copper foil is attached to the shield, and the main chip position is coated with thermally conductive silicone and thermally conductive silica pads.
A55 has a domestic audio power amplifier chip. The Silicon Integrated SIA8109 smart audio amplifier chip is selected, the chip output power 4.1W, can support speakers and earpiece.
Module information
6.5 inch LCD water drops, resolution is 1600x720. The screen model is BLD-HTF065H11B, and a graphite sticker is posted at the bottom of the back.
8 megapixel front camera is produced by tanker technology.
From left to right, the 3 megapixel main photos of the Omni Vision CMOS components, respectively, and 2 megapixel macro and 2 megapixel portraits.
Rated electricity 4980 mAh large-capacity lithium polymer battery.
Side fingerprint identifier, integrated power button function.
Motherboard IC information
The main IC of the motherboard (below):
1. Mediatek-MT6833-Tianzhu 700 64-bit 8 core 5G processor
2. Khynix-H9H15AECMBD-ARKEM-6GB memory + 128GB flash memory
3. Mediatek-power chip
4. Mediatek-WiFi, Bluetooth, GPS and FM Integrated Chip
5. Silicon Integrated-Si8109-Intelligent Audio Amplifier Chip
6. Sensortek-Light distance sensor
The main IC on the back of the motherboard (below):
Mediatek-power management chip
2. Mediatek-radio frequency transceiver chip
3. qorvo-RF front end module chip
4. qorvo-RF power amplifier module chip
5. qorvo-RF power amplifier module chip
6. Acceleration sensor chip
Summary information
The internal components use independent components to facilitate post-maintenance replacement. However, it is more cheap, and the plastic rear cover integrated FPC antenna is commonly used in early smartphones, but can still effectively reduce the cost of the whole machine. Unknown manufacturer's LCD display + unknown manufacturer battery + Haowei technology main photo, these options further reduce the cost of the whole machine. (: JUDY)
No matter the thousand-yuan machine or flagship machine, a variety of 5G mobile phones can be queried in the ewistech search restaurant!
Honor - V40
Samsung - Galaxy S21
The above is transferred from ewistech
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