OPPO Reno released a new series of high-frequency equipment, less than six months from Reno 3 pro, OPPO Reno 4 pro released on June 5. Not only continued high demand for video configuration, but also continued the previous generation of Snapdragon processor 765G. But we have to admit that the thickness of 7.6mm of Reno 3 pro, 172g weight on thin indeed achieve the ultimate. To achieve this ultimate thin and light, but also a device which benefited from it?
First, let's look at Reno 4 Pro Configuration
SoC: Qualcomm Snapdragon processor 765G Shu 7nm EUV technology
Screen: 6.5 inches Super AMOLED curved screen Shu Shu screen resolution of 2400x1080 accounted for 89.3%
Front: 32MP
Rear: 48MP main camera + 12MP ultra-wide-angle telephoto + 13MP
Battery: 3910mAh lithium polymer battery
Features: 65W fast charge | series electric double core | 90Hz screen refresh rate Surfaces | OIS optical image stabilization
eWiseTch dismantling equipment are all purchased from the market, the dismantling of this device is configured version 8GB + 128GB. Analysis of the data begin dismantling equipment prevail.
How to remove it?
First removed Reno4 Pro captopril, captopril have a dustproof and waterproof apron, stacked on top of the inner space saving design. Hot air gun heating cover, and binding sucker can pry open the back cover sheet, cover a large area foam.
Remove the main cover in turn, the sub-board cover, and the NFC coil FPC flash. Primary and secondary common cover plate 18 by screws with the screw portion tamper label.
Flash NFC coil FPC and the cover is fixed by glue on the motherboard, the motherboard integrated LDS antenna cover.
Then the motherboard, the sub-plate, the speaker module, the camera module and RF front coaxial. A motherboard by screws, the speaker is fixed by glue, to rest directly removed.
CPU motherboard position both inside and outside the shield is coated with a thermal grease. And an outer shield on the motherboard and IC dispensing devices are protected.
Rear back surface copper foil affixed to the camera module, in addition to the cooling effect may also serve as a fixed camera.
Reno4 Pro dual cell design of the battery can be removed by pulling the handle ends. Two electrical spacing between the core is about 1.4mm.
Interface USB Type-C board FPC is connected and the primary and secondary flexible plate is fixed by glue. USB Type-C interface using waterproof apron. FPC can see the screen at the same plug red silicone sleeve, you must first remove the subsequent dismantling of the screen.
Receiver, a vibrator, volume keys soft board, a power key FPC are secured by adhesive.
Finally, after heating the heating stage, and separating the screen and pry the support sheet with a sucker. Recalling the whole screen and a battery only using the silicone sleeve BTB interfaces are protected.
Thermal conductivity brass and fingerprint module is supported by the front over a large area covering the graphite sheet. Fingerprint recognition module using fingerprinting technology sink top screen design ultra-thin thickness of only 0.27mm.
Reno4 Pro machine adopts three-stage design, 19 screws. Samsung OLED curved screen design greatly reduces the overall thickness, screen thickness of only 1.3mm. Internal more comprehensive protection of bare IC on the motherboard and dispensing devices are protected. Cato and USB Type-C Interface silicone sleeve with a protective cover. Deputy board also posted a waterproof label. Cooling liquid cooling using a copper pipe coated with thermal grease on a large area of graphite sheets and the motherboard.
The three main rear camera, which 48MP main camera model for the Sony IMX586,12MP ultra-wide-angle camera model for the Sony IMX708,13MP telephoto camera model Samsung S5K3M5.
Dual cell battery design, a monolithic cell capacity 1955mAh. ATL batteries manufacturer for the company.
To discuss the shortcomings OPPO Reno 4 pro, then, is the point estimate of the maximum slot on the processor it is equipped with a. After all, OPPO Reno 3 pro with the 765G is Xiaolong. In addition to a look OPPO Reno 4 pro also familiar with what it IC!
Information Board IC:
The main IC of the motherboard (below):
1: Qualcomm-SM7250- Qualcomm Xiaolong 765G eight-core processor
2: Samsung-KM ****** JM-8GB flash memory + 128GB
3: Qualcomm-SDR *** - RF transceiver chip
4: Qualcomm-PM7 *** B- power management chip
5: Qualcomm-WCD **** - audio decoder chip
6: NXP-SN *** T-NFC control chip
7: MEMSIC-MMC **** - electronic compass
8: Ambient / distance sensor
The main IC on the back of the motherboard (below):
1: Qualcomm-WCN **** - WiFi / BT chip
2: QORVO-QM ***** - Chip front end module
3: QUALCOMM-PM **** A-power management chip
4: Bosch- gyroscopic accelerometer +
5: STMicroelectronics- Laser Focus sensor
6: Goertek- microphone
OPPO Reno 4 Pro today for dismantling on the share to this. However, its internal components eWiseTech analysis much more.
E been concerned about the small little friends, to see so many small e dismantling 5G mobile phones, electronic enthusiasts are willing to join the "ET star" family then?
There are many more in eWisetech 5G device, you must have been looking forward to that section.
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Reprinted from ewistech.
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