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    E dismantles: all said that REDMI 10X cost is high, it is better to be dismantled.

     

    5G mobile phone has now developed, 5G mobile phones within 2,000 yuan are not surprising. Can you still remember 5G mobile phones within 2,000 yuan? Red rice k30 (6GB + 64GB) price 1999, equivalent to the price of AirPods Pro. On May 26th, Redmi joined in Lianfa Tianzhu 820, released REDMI 10X, lowest price 1599. The main cost performance is truthful, and it is known. This dismantled is REDMI 10X, 6GB RAM + 128GB ROM version. The following data information is subject to disassembly equipment. Motherboard To the characteristics of REDMI 10X, then the first day of the 820 processor must be worth mentioning. First look at what is the length of this treatment, and it is in the motherboard. The main IC of the motherboard (below): 1: SkyWorks- - RF receiving module chip 2: SkyWorks- - RF receiving module chip 3: Bosch- - six-axis acceleration sensor + gyroscope 4: Micron--6GB memory + 128GB flash memory chip 5: Media TEK-MT6875V- 天玑 820 processor chip 6: Media TEK- - Power Management Chip 7: Media Tek- - Power Management Chip The main IC on the back of the motherboard (below): 1: Media Tek- -wifi / BT chip 2: Media Tek- - Power Management Chip 3: Skyworks- - RF front end module chip 4: Media Tek- - RF transceiver chip 5: Skyworks- - RF front end module chip 6: qorvo- - RF front end module chip (Tianzhu 820 processor supporting IC information, you can view BOM details in ewistech) Dismantle There is a silicone ring on the REDMI 10x's caloria, which can have a certain waterproof and dustproof. The rear cover is fixed by the inner support. After heating using a hot air gun, open it with a suction cup and a crow. There is a large-scale bubble in the back cover corresponding to the main panel connection soft plate. It is used to protect. The graphite sheet on the motherboard cover extended to the battery position, which is conducive to heat dissipation. The motherboard cover, the sub-plate cover and speakers are fixed by screws, and they can easily take it. The flashboard is fixed to the motherboard cover, and there is a small blue silicone having a small piece of blue silica. The rear camera module in the motherboard is also adopted by foam protection. On the motherboard, the camera soft board BTB interface is copper foil, which can protected and heat dissipation. Remove the motherboard and panel sequentially. And remove the camera and other components on the motherboard. The corresponding motherboard processor is corresponding to the inner support, which is applied with heat sink for heat dissipation. Silicone circles are available in the headphone holes and USB interfaces for waterproof. The battery is supported by the plastic tape, which is convenient to disassemble the pull handle. Press key soft plate, handset, fingerprint recognition sensor soft board, antenna plate, main panel connection soft board and other devices. Press the key soft plate to protect through the rubber cover. Silicone soft board has silicone ring for waterproof. The screen and the inner support pass the gel fixation, the disassembly method is the same as the back cover, and then takes a little bit with a crowder after heating. There is a large area of ​​graphite hot stickers on the inner support, and the heat dissipation is lowered by a heat-dissipated liquid, and the area is not too large. Looking back REDMI 10X machine design rigorously and uses traditional three-stage design. In terms of waterproof, the REDMI 10X is a silica gel ring at the SIM calorket, the USB interface and the earphone hole; the inside is heat dissipated by the graphite sheet + heat dissipation silicone-copper foil + liquid cooling pipe. The whole machine is excellent, and the dismantling is not big. Module The REDMI 10x screen features a 6.57 inches, 2400x1080 resolution AMOLED full screen, models of AMS657UF. After three photos, 48 ​​million pixel main cameras, models OMNI Vision Ov48b, the aperture is f / 1.79; 8 megapixel wide-angle camera, model is Samsung S5K4H7, the aperture is f / 2.2 Haven't I read it yet? Step Ewistech to view 1218 component information of the REDMI 10X machine. There is also an estimated cost waiting for you. In addition to this REDMI 10X, many 5G mobile phones have analysis. For example: Honor - x10 OPPO - RENO4 Pro Samsung - Galaxy A51 Finally, there are also group benefits waiting for you! Reprinted from ewistech.

     

     

     

     

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