June 1st vivo X50 Pro release, equipped with micro head of the main photo. As we all know, it is currently in a short video era, and the requirements for mobile video shooting are also getting higher and higher. In addition to high-pixels, video anti-shake is the primary problem. Compared to the external hand-held stabilizer, the mobile phone comes with a micro-cloud station is very convenient. How to put "Yuntai" into the mobile phone, how to run, come to reveal today!
Dismantle
Take out the calorker, after heating the back cover with a hot air gun, the binding chips slowly open. A waterproof rubber ring is provided on the X50 PRO toro. After separation, you can see the rear cover on the rear cover, and there is a bubbles for protection at the corresponding camera position.
Remove the motherboard cover and speaker, both of which are fixed by screws. The main board cover is attached to the motherboard and the earpiece module.
In addition to large-scale stone ink, there are NFC coils, sensor soft plates, and antenna plates.
The left side of the motherboard is protected by a plastic cover. The front camera soft board BTB interface is protected and heat-dissipating.
It is worth mentioning that the backward main photo of the micro-cloud is connected to the motherboard through two cables, and the other is responsible for motor drive.
Disconnect the cable on the motherboard, remove the motherboard, front and rear camera, panel and other components. The motherboard BTB interface is provided with a silicone ring for protection, and a silicone ring is used for waterproof.
The battery is supported by the plastic tape and is provided with a lifting handle to be convenient to remove the battery.
Remove the button soft plate, handset, fingerprint recognition sensor soft board, vibrator, main panel connection soft board, etc. At the gap that supports the screen softboard, there is a rubber plug protection in the tall groove.
The screen is secured by the inner support, and the screen is separated using the heating station. The liquid cooling pipe is covered with heat dissipation in the stone ink, and the area is large.
Vivo X50 Pro uses three-stage design, the whole machine design is rigorous, and the dismantling is medium. X50 PRO In the SIM calorker, the USB interface has a silicone ring for waterproof; there is a silica gel in the slot for protection, and the motherboard does not have a shield cover to cover it.
Vivo X50 Pro is heat dissipated by graphite blank + heat dissipation silicone-copper foil + liquid cold tube; the whole machine is equipped with three microphones, which are the main microphone of the bottom, and the top sub-microphone and the back camera side. Microphones can lock the video video picture body sound.
Yuntai module
The micro-cloud block consists of an external fixed frame, an FPC soft board, a upper and lower metal protection cover, a module fixed frame, a double ball suspension, a magnetic frame, a lens module, and a CMOS sensor.
The main part of the imitation in the module:
The coil drives on the FPC soft board achieves anti-shake, and the double ball suspension encapsulates the lens group with CMOS, so that the entire camera module achieves anti-shake. The CMOS cable is designed into a dual-type, which reduces the traction of the soft board to the main photo, and improves anti-shake accuracy.
Motherboard IC:
The main IC of the motherboard (below):
1: qorvo-qm ***** - front-end chip
2: QUALCOMM-WCN **** - WIFI / BT chip
3: QUALCOMM-SDR *** - RF transceiver chip
4: QUALCOMM-PM **** B-power management chip
5: Samsung-km8v **** JM-8GB memory + 128GB flash memory chip
6: QUALCOMM-SM **** - Qualcomm Snapdragon 765G processor chip
7: STMicroelectronics-Ism **** - 6 axis acceleration sensor + gyroscope chip
8: QUALCOMM-WCD **** - Audio Codec Chip
9: NXP-SN ****-NFC Control Slices
The main IC on the back of the motherboard (below):
1: QUALCOMM-QPM **** - RF power amplifier chip
2: QUALCOMM-QPM **** - RF power amplifier chip
3: QUALCOMM-QPM **** - RF power amplifier chip
4: QUALCOMM-QDM **** - front-end module chip
5: QUALCOMM-PM **** - Power Management Chip
6: NXP-high efficiency D audio amplifier chip
7: STMicroelectronics-6 axis acceleration sensor + gyroscope chip
8: QUALCOMM-PM ***** - Power Management Chip
9: qorvo-qm ***** - front-end module chip
The increase in the rear camera volume of the Vivo X50 Pro caused a small number of main boards to become higher. The motherboard does not cover the shield is applied to a single glue to waterproof, which is better than a lot of high-end models. The whole machine is used to use a mid-range. Unfortunately, wireless charging, duplex, and Z-axis motor are not supported. The processor is selected is the Qualcomm Snapdragon 765G processor, which is the same as many mid-range models. The blessing of micro-cloud block makes X50 Pro more advantages in a mid-range model.
For the dismantling of Vivo X50 Pro, more detailed information is waiting for you in ewistech, in addition to this,
Glory 30
Huawei P40
Millet 10
OPPO RENO 4 Pro
Reprinted from ewistech.
Our other product:
