When the domestic mobile phone brand is competed, the iPhone quietly released the new SE, although only a 4G mobile phone, still triggered a wave of attention. For this mobile phone, how can the small e do not remove it?
Dismantle
The dismantling iPhone consistently adopted ahead.
First use the card needle to take the metal calorie, and the calorium has a silicone ring to waterproof. The screen is fixed by a buckle, a glue, and a bottom two screws. The screen cable is fixed to the motherboard through the screws and metal cover, and the cable can be disconnected to remove the screen. iPhone
Here you can see that the internal structure is highly consistent with the IPHONE 8 structure. The test part of the component can be shared. (The picture below is iPhone 8)
A metal fixing plate, an earphone, a front camera soft plate, a sensor soft plate, a fingerprint identification module are integrated on the screen panel.
Both metal fixing plates and soft plates are reinforced by a screw, but the soft plate is reinforced. A large-area graphite sheet is attached to the fixed plate. The handset is connected to the sensor soft board with the upper shrapnel. The front camera soft plate and the sensor soft plate are welded together by solder joints.
Then, all BTB metal cover on the motherboard and soft board then remove, and then take the top of the top for 2 black modules, 2 pieces of soft plates, and post camera soft plates for connecting the motherboard and the rear cover antenna. The IC and devices on the soft board are processed.
The motherboard is fixed by screws. On the motherboard, there is not only large-area stone ink heat dissipation, but also attached to the CPU position. BTB interfaces are also protected by foam.
2 LCP boards on the motherboard can reduce signal loss, while replacing the RF coaxial line.
The speaker and Taptic Engine modules are fixed by screws.
The sub-plate is fixed by screws and gum. Lighting interface waterproof by white silica gel.
The battery is fixed with 4 classes through the upper and lower ends.
Finally, remove the side key soft plate and the wireless charging coil, where the wireless charging coil is fixed by a glue, and the side key soft plate is fixed by a screw and a glue. The button is fixed by the metal sheet. After removing, the button cannot be restored, and the button is used to waterproof.
iPhone SE 2 is fixed with 67 screws, the internal modularity is high, but the button, microphone, and flash are integrated on the button soft plate; the front camera soft board and the sensor soft board are welded together, and integrated a front camera, ambient light Sensor, distance sensor and microphone.
In terms of heat dissipation, not only on the motherboard is attached to a large area of heat-dissipating graphite, but the internal A13 Bionic processor also uses heat transfer silicone heat. In addition, internal components protection measures are well done, and BTB interfaces are protected by dispensing protection by foam protection, board and soft board.
Motherboard IC
The main IC of the motherboard (below):
1: Apple-APL1W85-A13 Bionic processor
2: SK HYNIX-H9HK ********* - 3GB memory chip
3: Intel-xmm **** - 4G baseband chip
4: Cirrus logic-cs ****** - A1-Audio amplifier chip
5: avago-afem - **** - Power amplifier
6: Bosch-gyroscope + accelerometer
7: Bosch-Pneumatometer
8: ALPS - Electronic compass
The main IC on the back of the motherboard (below):
1: MURATA-339S ***** - WIFI / BT chip
2: NXP-SN *** - NFC control chip
3: Apple-APL **** - Power Management Chip
4: Intel-Pmb **** - Baseband Power Management Chip
5: Cirrus logic-cs ***** - Audio decoding chip
6: Toshiba-Tsb **** ma **** TWNA1-64GB flash memory chip
7: Intel-Pmb **** - RF transceiver chip
8: Broadcom-bcm ***** - Wireless charging receiving chip
The integration is very high, of course, far more than these IC information, more information stamp Ewistech View, HD module map is also waiting for you! Also in Ewistech ...
Apple - iPhone8
Huawei - P40
Xiaomi - Mi 10
Reprinted from ewistech.
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