Before I said the 1999 red rice K30 how to control the cost, and Realme X50 is equipped with the Snapdragon 765G mobile platform, support SA / NSA dual-mode 5G, minimum price 2499 yuan also makes it a low price 5G mobile phone, then Realme X50 How do you control the cost?
E dismantles
RealMe X50 uses upper and lower stacked calories, effective saving space, and has a rubber-proof and waterproof effect on the Catto. The glass rear cover is fixed by the glue, and there is a large-scale bubble cotton on the back cover, which functions as a buffer protection.
The rear end cover is fixed by a screw and a buckle with an internal support module. There is a circle of bubbles around, avoiding directly with the inner support.
Flash soft board, side fingerprint identification module, back camera cover, soft plate connected to the motherboard to the rear end cover through the adhesive.
In addition, four FPC antennas and 4 LDS antennas are also integrated on the rear end cap.
The speaker module is fixed by a black tape, while the motherboard, sub-plate and main panels are directly removed. BTB interface on the motherboard is protected by blue silicone sleeve, and the devices except the shield on the motherboard are protected.
Then remove the earpiece, vibrator, volume key soft plate, SIM card slot soft plate, USB TYPE-C soft board, and RF coaxial line. Among them, in addition to the radio frequency coaxial line, all of which are fixed. The USB TYPE-C interface adopts a dustproof and waterproof.
Finally, the screen and internal support are separated by the heating station, and the heat conductive copper tube is removed. There is no touch chip on the screen, it should be integrated in the screen.
Realme X50 5G The overall design is rigorous, and the entire 22 screws are used. The rear end cover designed, the FPC antenna and LDS antenna are integrated on the rear end cover. This design is rare, and of course, it will be slightly lower. On the waterproof treatment, the SIM calorket and the USB interface have a silica gel dust and waterproof. The heat dissipation is heat dissipation by graphite + heat-conductive silicone stomatherapy + liquid cold copper tube.
E analysis
After ewistech dismantling and the overall analysis of the components of Realme X50, there are 1613 components, and the cost estimates of materials are approximately 211.11 dollars. The quantity is the highest than Japan, but the cost is only 15.3%, its main area is in the device, camera sensor; the US cost is 33.1%, but only 58 components, its main area is in IC China provides the main area of components for non-electronic devices, cost proportion of cost is 24.1%,
In the overall 1613 components, the cost of the main control IC is 50% in the cost of the material cost. What main control ICs can you see at the motherboard?
The motherboard front:
1: QUALCOMM-SM7250-Qualcomm Snapdragon 765G processor chip
2: Samsung- KM8V8001JM-8GB memory + 128GB flash memory
3: QUALCOMM-SDR865-radio frequency transceiver chip
4: QUALCOMM-PM7250B-Power Management Chip
5: QUALCOMM-WCD9385-audio codec chip
6: QUALCOMM-WCN3998-WiFi / BT chip
7: NXP-SN100T-NFC control chip
8: AKM-AK09918C-Electronic compass
9: Light / distance
Back surface of the motherboard:
1: qorvo-qm77040-radio front end module chip
2: QUALCOMM-PM7250-Power Management Chip
3: BOSCH-BMI160-gyroscope + accelerometer
4: Goertek-Microphone
In addition, multiple MEMS chips that are also used on the whole machine, more detailed information enters the Ewistech search, and HD pictures are waiting for you. (Edge: ashely)
There is also ...
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Reprinted from ewistech.
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