Globalfoundries today announced the introduction of a micro-contained magnetic random memory (EMRAM) technology based on the company's 22-nanometer FD-SOI (22FDX) platform. As the most advanced embedded memory solution in the industry, the core 22FDXemram provides excellent performance and superior reliability for consumer fields, industrial controllers, data centers, Internet of Things and automobiles.
As recently displayed in the United States, the core 22FDX EMRAM has industry-leading storage unit sizes, which has the ability to retain data in 260 ° C reflow, while allowing data to retain more than 10 years in 125 ° C. This industry leading technology advantage allows it to be used in microcontroller units (MCUs) in general, industrial and automotive sectors. FDXTM and EMRAM can operate along with RF connection and millimeter wave IP, which makes 22FDX become a battery-driven Internet of Things and an ideal platform for automatic driving vehicle radar tablets (SOCS).
"With more and more applications require high performance, non-volatile memory solutions, customers are trying to extend the ability to extend the product." Dave Eggleston, vice president of M & C, Vice President, said, "We are very happy to release 22FDX Emram. As an embedded memory technology with excellent reliability, it can provide more features to the system designer in the Microcontroller (MCUS) and SMS (SOCS) while increasing its performance and energy efficiency. "
The high reliability and scalability of the Melody Emram makes it a cost optimization choice on the advanced process nodes in multiple markets. In addition, the multi-functionality of the core EMRAM makes it possible to simultaneously have a fast write performance and high persistence, which also makes it simultaneously used for code storage and work storage. This 22FDX EMRAM has been launched in the results of Multi-year cooperation with Everspin Technology. At present, the double rate of the 1GB capacity The MRAM chip has been demonstrated and the 256MB capacity double rate MRAM chip has been produced, and is exclusated by Everspin.
22FDXemram and RF solution process design tool packs are now released. Multi-project wafers (MPWS) facing 22FDX EMRAM Customer Samples are in progress and will be delivered in the first quarter of 2018, and the risk production is planned at the end of 2018. Mage and its design partners have introduced EMRAM custom design services, including EMRAMs from 2MB to 32MB, and provide convenient embedded flash memory (EFLASH) and Static Random Memory (SRAM) interface options.
Original link: https://www.eeboard.com/news/gexin/
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