The 1399 REDMI Note 8 Pro is called the "Qianyuan Emperor", and 64 million afterwards are rare, but the combined processors used are also discussed. Since there is a dispute, you have to take a look!
Dismantle
Take out the calorium with the silicone ring, and after the heat is heated, the fixed glue is softened, and the slit can be opened.
Note that the fingerprint sensor soft plate is connected to the back cover, there is a plastic cover to the BTB interface position, and the back cover corresponds to the main sub-board connection soft plate with a bubbles for protection.
The main sub-plate cover and the speaker are fixed by a screw, and the NFC coil is fixed to the main plate through the glue and is used for heat dissipation. The copper foil is attached to the camera soft board.
Remove the motherboard, front and rear cameras, panels and other components. It is observed that the internal support of the main board flash & memory location is observed. The secondary plate USB interface and the earphone hole are set with a silicone sleeve.
The battery is supported by two easy-pull gelatin.
Remove the side key soft plate, vibrator and other components. In the sensor soft board, there is a silicone ring, and the liquid cooling tube on the inner support extends from the motherboard with a heat dissipation silicone lipid to the battery position helps to improve heat dissipation efficiency.
The screen is supported by the inner support. Heating the screen to a certain temperature can separate the screen and within.
Redmi Note 8 Pro machine is three-stage design, designed and rigorous. Sub-board cover has a separate cover for protection. SIM Cardo, earphone hole, USB interface, etc. have silicone circles for waterproof. In terms of heat dissipation, the liquid cold tube + graphite sheet + heat dissipation silicone is carried out, and a graphite sheet is also applied to heat dissipation on the NFC coil.
E analysis
What is the main module information of the REDMI Note 8 Pro machine? The material cost is about ...
The first is 6.53 inch Tianma IPS full screen, the model is TL065FVxF. The module price is about $ 17.8.
Front 20 million pixel camera, model is Samsung S5k3T1, and the module cost is approximately $ 6.
The 64 megapixel main camera in the rear 4 is Samsung S5kgw1. The overspeed material cost of the entire four-shifter group is about $ 16.5. More detailed four-time module information enters the Ewistech searched query.
The cost, REDMI Note 8 PRO total 1011 components, the material cost is about $ 147.768, according to the supplier country classification, it can be seen that although the number of devices provided by Japan is much more, the overall material cost is low.
China has the highest proportion of cost in the cost, although Tianghua screen accounts for a large proportion, but main areas are non-electronic devices, connectors. In the component TOP5, the first is to provide the stored Korean SK HYNIX.
In the total cost of materials, the main control IC occupies 41% ratio and reaches $ 64.46. So what are the master ICs? Where is it? Let's take a look at the motherboard!
Motherboard front IC:
1: QUALCOMM - SMB1351 - Fast charge chip
2: NXP - TFA9874 - Audio amplifier chip
3: Media Tek - MT6360 - Power Management Chip
4: Media Tek - MT6631N - WiFi / BT / GPS chip
5: SK HYNIX - H9HQ53AECMMD - 6GB memory + 64GB flash memory chip
6: Media TEK - MT6785 - Union G90T chip
Back surface IC on the motherboard:
1: NXP - SN100T - NFC Control Chip
2: Media TEK - MT6359V - Power Management Chip
3: Skyworks - SKY77638-21 - RF power amplifier chip
4: Skyworks - SKY77912-61 - RF front end module chip
5: Media TEK - MT6186M - RF transceiver chip
5 MEMS chips shared on the whole machine are as follows!
Article Source: ewistech
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