The Samsung A series of conferences, A80 must be the best C bit, and in fact A70 is also a good product. Xiao E, of course, didn't let it, put two mobile phones in the capsule early. Before the complete dismantling of A80, let's take a look at this A70.
Configuration list
SOC: Qualcomm Snapdragon 675 processor 丨 11nm process
Screen: 6.7 inch 丨 Samsung Super AMOLE screen 丨 resolution 2400x1080 丨 Screen accounted for 86%
Storage: 6GB RAM + 128 ROM
Front: 32MP
Back: 32MP main photo + 5MP depth of field + 8MP super wide angle
Battery: 4400 MAH lithium ion battery
Features: Support NFC 丨 optical screen fingerprint identification 丨 25W fast charging
Dismantlement step
Under the SIM card, you can see that the card slot is plastic, the card slot type is SIM 1 + SIM 2 + microSD. Then use the hot air gun to heat the edges, remove the back cover, you can see the white strip on the back cover, used to secure the back cover and the middle frame. There is a large bubble pad at the back cover, which is used to protect the battery. There is a model label on the back cover.
The glass rear camera cover on the rear cover can be removed, and it is fixed with black gum and remove it with a pour. The back camera cover is on the front of a bubble pad protects the camera.
The middle frame and the inner support are fixed by the snap and screws, first remove the screw, and then open the connection with a crowbar, and separate the boxes and internal support. You can see that there is a stone ink on the box, and the corresponding on the motherboard is used for heat dissipation of the motherboard. A metal sheet for heat dissipation is also attached to the motherboard.
Remove the parts on the box, press the key soft plate through the glue, the speaker is fixed to the front of the middle frame through the snap, the NFC coil is fixed in the middle frame. The speaker has a graphite film for heat dissipation, and the sound port is used as a mush and a filter for waterproof and dustproof.
Remove the components such as motherboards, panels. There is a silica gel pad and a silicone ring at the microphone for waterproof. There are two silicone stains at the corresponding motherboard for heat dissipation. Following protection at the BTB interface.
Take the battery, the same axis, and the remaining small parts. The battery is supported by white double-sided adhesive.
Plus the heating station temperature to about 85 ° C and remove the screen. There is a copper foil in the front side for heat dissipation, and the back camera should be in front. There is a transparent double-sided adhesive in the middle of the inner support to make the screen and the inner support are more secure.
Module information
The screen uses a Samsung 6.7-inch Super AMOLED screen with a resolution of 2400x1080.
The front photo adopts Samsung 32 million pixel camera, the model is S5kgd1.
The post-photo adopts Samsung 32 million pixel main photos, model is S5kgd1; 5 million-scented scenic depth; Samsung 8 million pixel super wide angle, model is S5K4HA.
The fingerprint sensor under the optical screen is the second generation of fingerprint recognition launched by God.
The battery uses 3.85V, 4400mAh Li-Ion battery, and the battery cell manufacturer is Samsung.
Motherboard IC information
The main IC of the motherboard (below):
Red: STMicroelectronics-six-axis (gyroscope + acceleration) sensor
Light red: distance sensor
Yellow: Light Sensor
Light blue: Fairchild Semiconductor-Data Channel Switch
Blue: Skyworks - Dual Bave Wireless Chip
Purple: QUALCOMM-Audio decoding chip?
Green: QUALCOMM - Qualcomm Snapdragon 675 Bar Nucleus Processor
Cyan: Samsung- 6GB memory + 128GB flash memory
Brown: QUALCOMM- Fast charge chip
Yellow Green: DioDes-Noise Amplifier
The main IC on the back of the motherboard (below):
Red: Qualcomm- Wi-Fi, Bluetooth, FM Radio Chip
Orange: Samsung-Power Management Chip
Yellow: QUALCOMM-Power Management Chip
Green: QUALCOMM-speaker enlarged chip
Cyan: QUALCOMM-Power Management Chip
Blue: NXP-NFC Control Chip
Purple: BSE-microphone
Brown: AKM-three-axis electronic compass
Deep Green: Infineon-Antenna Switch (2)
Light green: Skyworks- Diversity Receive Chip
Darkness: QUALCOMM-radio frequency transceiver chip
Light blue: MURATA-RF simulation device
Shallow purple: NXP-noise amplified chip (2)
Deep purple: RF simulation device?
The logic, Memory, PM, and RF chip information used on the motherboard are shown in the table:
The MEMS chip information used on the whole machine is shown in the table below:
Summarize
The whole machine uses 17 screws to fix, medium boxes and internal supports, in the middle frame and the speaker are fixed by the snap, and the remaining parts are fixed by the gum. There is a heat dissipation material such as silicone fat, graphite sheet and metal sheet at the motherboard for heat dissipation. Both microphones have silicone ring and silica gel cushions for waterproof. This machine is more simple, and the parts are small, and the restore is also more convenient.
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Source: ewistech
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