New Year's start, Ewistech continues to explore mid-end mobile phones. The 5G mobile phone on the market has sinking to thousands of yuan, it is used to all brand flagship machine disassembling, Ewistech also launched a thousand yuan 5G dismantling stage, Decomposition 998 RealMe Q2i, today we will dismantle Look at the 1399 OPPO K7X, it also looks at the difference between the 5G mobile phone of this difference between this difference.
The OPPO K7x configuration is first reviewed before dismantling.
SOC: DIMENSITY 720 processor 丨 7nm process
Screen: 6.49 inch LCD screen 丨 resolution 2400x1080 丨 90Hz refresh rate
Store: 6GB LPDDR4X DRAM + 128GB Flash
Front: 16MP
Back: 48MP + 8MP + 2MP + 2MP
Battery: ATL 4900MAH Lithium Ion Polymer Battery 丨 30W VOOC Flash
Features: 90Hz screen refresh rate 丨 30W flash charge 丨 Dual mode 5G
It is not difficult to see that the K7x mainfast is endless from the configuration information. However, the screen and Tianzhu 720 processor with 90 Hz refresh rate will not be too bad. Negotiate the interior structure.
Dismantle
Before the disassembly, the calorker is taken first, and there is no waterproof ring on the calorie. The rear cover and the body are fixed to fix the back cover with a hot air gun, and the rear cover can be opened. There is a foam for supporting buffer in the inside of the rear cover.
The camera protective cover is fixed to the middle frame, and there is a protective bubble in the protective cover opening position. There is a black plastic piece on the corresponding motherboard position on the box. There is a fixed screw on the graphite sheet on the speaker module.
The fixation of the inner frame and the internal support is mainly through the card slot and screws, slowly open the snaps along the four weeks. In the middle frame, you can see a large area of graphite cooling stickers and 5 FPC antennas, and the motherboard shield is also attached to copper foil.
Flash softboards and graphite stickers are used to use double-sided adhesive stickers. Use the leatch to remove the flash soft board
Then disconnect the BTB interface on the motherboard, remove the back camera module, front camera, and screw fixed side fingerprint sensor and speaker module. Speaker module sub-plate connected to the adapter by a flexible plate, there is a circle foam, the sub-board label affixed waterproof around. In the rear camera position, there is a conductive cloth, 48MP main photo is posted with copper foil.
The battery is pasted with plastic tape, and it is difficult to deform after removal. There is a black bubble strip on the right side and below the battery slot position, and the fill the gap.
Remove the motherboard, panel, main panel connection soft board and the same axis. The two microphone positions on the inner support are provided with red blue two colors, and there are silica gels on the USB interface, respectively. There is also a waterproof label on the corresponding headphone interface position on the support.
There is a copper foil and a thermally conductive silicone on the shield of the motherboard. After we remove the copper foil, you can see that the motherboard is in front of both sides with thermally conductive silicone.
The handset, the two-sided button soft plate, the speaker connection soft board and the vibrator are fixed by double-sided adhesive.
Finally, open the screen, remove the graphite tile under the screen, and the device position is protected by insulating tape, and there is also a large-area graphite tile, and there are four conductive bubbles in four weeks.
Retrospecting the dismantling, the OPPO K7x is in common three-stage design, and 19 screws are used, and the dismantling is relatively simple. Internal use three waterproof labels, heat dissipation uses conventional thermally conductive silicone + copper foil + graphite sheet. Based on cost considering K7X uses a side key fingerprint recognition. The FPC antenna is also used as an antenna.
Finally, according to the practice, let's take a look at some of the partial ICs on the motherboard.
The main IC of the motherboard:
1: Media TEK-MT6853V- 天玑 720 八 核 处理器
2: SK HYNIX-H9H16AECMMD-6GB memory + 128GB flash memory
3: Media tek-mt **** - Power Management
4: STMicroelectronics-acceleration sensor + gyroscope
5: RockChip-rk *** A- fast charge chip
6: vanchip-vc **** - Power amplifier
7: Media Tek - **** N-WiFi Bluetooth chip
8: QUALCOMM-QDM **** - front end module
9: SENSORTEK-STK ***** - Light Distance Sensors
The main IC on the back of the motherboard (below):
1: qorvo - qm ***** - front end module
2: Media Tek - MT **** W - RF transceiver
3: Smartermicro - S55255-5G frequency band RF front end integrated transceiver module
4: Goertek-Microphone
5: Media Tek - MT **** V - Power Management
It is worth mentioning that the K7X uses Huizhi microelectronics S55255. This is to dismantle 5G mobile phone, I saw the domestic 5G RF chip in the mobile phone for the first time.
(Introduction: S55255 series products are the N77 / N79 RF front end module developed by Huizhi micro-based AGI5GTM reconfigurable RF front platform: support N77 / N79 frequency band; integrated power amplifier PA, low noise amplifier LNA and radio frequency transceiver switch; integrated Filter.)
The above is part of the analysis of the OPPO K7x, more detailed BOM and HD pictures removing EWSETECH searches.
Previous review
5G thousand yuan machine demolition articles
Realme - Q2i
Realme - X7 Pro
Huawei - Enjoy Z 5G
5G flagship machine demolition
Xiaomi - MI 11
Apple - iPhone12 Pro
Samsung Galaxy Note20 5G
Huawei - Mate40 Pro
Reprinted from ewistech.
Our other product:
