Trilumina launches 3W surface mount flip chip back to the base without pedestal vcsel array

3D sensing application Flip chip (FLIP-CHIP) vertical cavity emitting laser (VCSEL) Leader developer Trilumina® announced the launch of the world's first 3 W surface mount flip chip back to emission VCSEL array without need for mobile 3D Sensing camera of the camera or bond line. Compared to traditional VCSEL for 3D sensing, this new board can achieve higher performance, smaller size and lower cost, and simplifies flight time (TOF) camera supply chain. . [Caption id = "attachment_411142" align = "aligncenter" width = "267"] The TriLumina 3 W VoB SMT VCSEL array has the smallest footprint with the lowest cost implementation in its class, making it ideal for use in mobile devices. [/ CAPTION] Brian Wong, President and CEO of Trilumina, said: "We are very happy to launch 4W Vob for automotive applications in the summer. Now, smaller specifications are created by new 3 W flip chip VOB, Trilumina, Compared with the regular top of the mobile TOF application, the solution is thinner, smaller, and more performance. " Traditional VCSEL arrays are mounted on a base and electrically connect using bond wires. The new 3 W VoB Surface Mounting Technology (SMT) equipment has a compact, surface-available design, which consists of a single VCSEL array chip, which is welded to the printed circuit board (PCB) through standard SMT, no need to print Other SMT components on the board are used for the base carrier of the VCSEL chip. Trilumina's integrated back etching microlens technology can be integrated optical components, and can further reduce the device height compared to conventional VCSEl with independent optical lenses. It has the least footprints and lowest cost of similar products, which is ideal for all kinds of mobile devices. Although the direct flip chip SMT technology has been used in other components such as RF (RF) and power field effect tube (FET) chips, Trilumina's VOB is the first time of the VCSEL device. VCSEL devices use copper columns with solder bumps currently used for other types of products, and mounted directly to printed circuit boards using standard lead-free SMT, due to the unique back of Trilumina, has built-in seal and excellent thermal performance. Other advantages. The VOB series is now starting sampling. Please contact Trilumina to get data tables and other technical and pricing information.

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