The first transcript of the Joint Cai's Cai Li's line will be unveiled! According to industry insiders, UNICE has completed the design of mobile phone chip's built-in AI (artificial intelligence) arithmetic unit, which is expected next year, a new generation of Heliop70 mobile phone chips, will build internal neural network and visual operation unit (NVPU), which is expected to adopt TSM 12NM process tick.
Lianfa completed mobile phone chip built-in AI arithmetic unit design
Apple recently announced the launch of the A11bionic application processor to be equipped with the Neural Network Processing Engine (Neuralengine) to support the 3D sensing and face recognition function established in the new iPhone, which can process the corresponding corresponding per second. The number of neural networks can reach 6,000 billion times, and provide performance support for the identification of face features.
The industry pointed out that UNAV HELIOP70 will be a trip stone that has entered the intelligent terminal AI market. After next year, there will be more mobile phone chips to carry NVPU operation unit, which is expected to recognize face recognition, iris recognition, 3D sensing, image processing and other AI new functions. Brought into the smartphone market, Liaotai is expected to regain the growth kinetic energy by AI.
Including Intel, NVIDIA, Xili Si and other major plants are actively layout AI, which can be used to apply applications such as deep learning or machine learning. However, in the terminal device of smartphone, the mobile phone chip factory has also begun to support AI applications, such as Huawei's Hai Si semiconductor launched 10 nano-unicorn 970 mobile phone chip, built the neural treatment component (NPU), can achieve up to up to The processing speed of 2,000 photos per second.
Lian Zike is a specific results of the research and development of the establishment team to catch the AI arithmetic unit for caught up with the large factory. According to the industry, UNICE has completed the core design of the AI chip of the neural network and visual operation unit, will be the Heliop70 mobile phone chip launched next year, will be a mobile phone chip in Lianfa, which is expected to be officially in Taigui Power in the first half of next year. Take a 12nm process, follow-up, also launched a variety of Heliox and P-series mobile phone chips in built NVPU cores.
The industry pointed out that Apple brought 3D sensing technology into the iPhone, Android camp smartphones will follow into import 3D sensing applications next year. Whether it is Apple or Qualcomm, the 3D sensing used by the flyer ranging (TOF), because a large number of image calculations are required, the mainstream ARM architecture processor speed is insufficient, so future mobile phones The chip will definitely build a core of AI.
Original link: https://www.eeboard.com/news/mtk-13/
Search for the panel network, pay attention, daily update development board, intelligent hardware, open source hardware, activity and other information can make you master. Recommended attention!
[WeChat scanning picture can be directly paid]
Technology early know:
Foxconn United States Construction Factory employee wages stunned
Huang Zhang's backup, really can save a Meizu who has been in the "death" road?
Google acquires HTC, HTC Pixel mobile phone R & D team joined Google Team
Want! The world's first AMD Ryzen notebook is about to sell: 100,000 yuan
The price of memory is booming, DIY buyers say: can't afford it, reveal the mystery of memory prices skyrocket
Our other product:
