MEMS is one of the fastest growing technologies in the semiconductor field in recent years, so how to accurately predict MEMS's future? A.M. Fitzgerald and Associates LLC Founder Alissa Fitzgerald Share the optimistic view of MEMS future development, and predicts advanced technology that will change the rules of the game ...
In the International Semiconductor Industry Association (SEMI), the microelectromechanical system (MEMS) technology grows fastest in the semiconductor field in recent years, so how to accurately predict MEMS's future? Learn about the history of MEMS components, and reviews the MEMS's most innovative 500 academic papers, MEMS design and development company AM Fitzgerald and Associates LLC founders Alissa Fitzgerald this year MEMS and Sensor Peak Meetings (Mems & Sensors Executive Congress ) Share the optimistic view and forecast for MEMS future development when speaking.
Fitzgerald believes that "the next $ billion products will hide in the college research literature." In 2017, the academic paper reveals the sensor of passive and nature-zero, as well as paper and plastics. The solution replaces an expensive silicon base solution as the latest developments such as consumer applications and one-time special products.
Am Fitzgerald's future development of MEMS is bamboo in the chest, they are committed to applying novel academic and entrepreneurial ideas into small MEMS wafer plants, benefiting them, just like commercial silicon and insulating silicon (SOI) using Soitec Waver Rogue Valley MicroDevices (RVM) company.
MEMS Design and Development Company A.M. Fitzgerald & Associates Founder Alissa Fitzgerald delivered a speech at SEMI 2017 MEMS and Sensor Peak Meeting
Fitzgerald talked about the historical origin of MEMS technology, the earliest can be traced back to the development of three-dimensional (3D) force sensor in 1980, which caused Kurt Petersen invented a pressure sensor based on block silicon micromachining technology. The pressure sensor finally realizes an ink jet nozzle, which has promoted the appearance of digital light processing (DLP) MEMS, soon there is also the first manufacturer to trigger airbags using accelerometers from Adi, which is more than traditional pipelines. Faster technology.
"From then on, Bosch's depth reaction ion etch (DRI) process opened a new era, realizing the world's first MEMS gyroscope. Thin membrane acoustic resonator (FBAR), and MEMS piezoelectric And the wide use of aluminum nitride (AlN) film also spawned the various MEMS components we have today. "
Fitzgerald said that another important invention is "Eutectic Bonding" that enables InvenSense to engage your own ASIC wafer to the MEMS chip to achieve automatic sealing, there is no additional closure step. "
RVM founder Jessica Gomez (right) (manufactured by A.M. Fitzgerald) and SOITEC Business Development Director Nazila Pautou (SOI Waver for RVM)
According to FITZGERALD, the early, Adi and Bosch are mainly more than 50% of market demand, and the remaining 400 small companies have a surplus market. But with the popularity of smartphones, the huge consumer market has made these 400 small companies a major force in the market.
So where is the idea of all these consumer markets? Fitzgerald believes that it is large to be traceable to academia, and they "cultivate creative in college laboratory" as a solution for finding problems. A.M. Fitzgerald and other agencies have implemented the ideas of scholars in the design and developed into products suitable for sales, providing kinetic energy for today's global gaming dollars.
In the RVM wafer factory, engineers are detecting MEMS wafers; the wafer is A.M. Fitzgerald designs with SOITEC's SOI technology.
Looking forward to the future, then deep plowing, find out the techniques of university laboratories being infertock. Fitzgerald said in the speech. "After reviewing the 200th papers in 2017, we have a commercial feasibility screening, which is expected to change the global game rules."
Future MEMS - paper or plastic?
According to Fitzgerald, the first batch of techniques to rewrite the rules of the game will be from the new use of the FBAR and the SAW (SAW) sensor.
Currently, FBAR and SAW technologies are mainly used in RF (RF) filters. Fitzgerald said: "According to the literature data, they can also be used to produce a passive sensor without a battery; this sensor without a battery is still awakening the processor when reaching a particular parameter." In addition, this sensor can provide a height. Accurate extreme temperature detection, can also play a role in pressure limit, and even detect specific gases.
She said: "These passive sensors are very suitable for harsh environments, in this environment, you can't replace the battery; and they also have high performance of zero-standby power consumption."
After further studying the MEMS literature in 2017, she also found nearly zero power components, sometimes referred to as "event drive type" sensors. They are similar to passive components, but use very small μA current, and power consumption in standby mode is less than 1pw. When they perceive specific events, they will wake up and trigger the application processor.
A.m. Fitzgerald and other MEMS chip designers can use 8, 6, 4, 3 or even 2 inch wafers (from right to left) based on pure silicon or SOI (left)
Fitzgerald Example: "Northeastern University has proven that nearly zero-powered infrared (IR) sensors can realize the sensitive functionality of wavelength, and can wake up the network (IoT) device or the processor in the security monitor Even in large arrays, they can still use small energy acquisition techniques as a spare power. "
Many new MEMS components today use piezoelectric materials, not only for energy acquisition, but also realize applications of wide-range micro speakers, magnetometers, and even transformers, without authorizing high efficiency but expensive DRI process.
MEMS wafer batch treatment in RVM in Olygang, USA
Fitzgerald said: "For low equipment and Internet of Things, the consumer market industry is mature because it can achieve a one-time use through large-scale mass production."
At the same time, MEMS researchers are committed to exploring methods of replacing expensive silicon crystals. Fitzgerald said that in 2004, 90% of the MEMS components worldwide were manufactured by surfaces of a block silicon or silicon substrate; however, half of the next generation components described in the literature were plastic or even paper substrates.
She said: "Based on paper-based technology is increasingly replacing billions of dollars of expensive silicon wafers, especially for discarded applications only, usually only less than 1 cents of sensors." Based on plastics Or the components of the paper substrate are not rapid or accurate as silicon-based components, but their performance is sufficient to meet consumer products that are short-lived or frequently replaced, as well as one-time abandoned application needs.
For example, paper sensors can be used to detect specific types of bacteria. These components can reduce the needs of various antibiotics, especially because many antibiotics may promote superbacterial evolution. Similarly, the paper food packaging can be embedded in the paper-based assembly, inform consumers' foods actually become metastasis, to replace the "effective period" stamps today.
The final MEMS chip produced by RVM (20 samples here), ready to supply customers
Fitzgerald said: "It is expected that in 2020, people will see a new type of piezoelectric event-driven new sensor; in 2030, we will see a substantial growth of paper and plastic sensors."
She said that the CMOS + sensor design of built-in reading still needs to use silicon. However, "As the study of silicon crystal technology slows, it is popular with cheaper paper components, and the silicon crystal technology has a risk of stagnation."
Original address: https://www.eeboard.com/news/mems-3/
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