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BGM220 Bluetooth Suite Hardware Introduction
BGM220 Bluetooth Suite SIP Module
BGM220 Bluetooth Suite PCB Module
BGM220 Bluetooth Suite Software Development Environment
BGM220 Bluetooth Kit Routine Demo
BGM220 Bluetooth Suite Power Consumption Shown Monitoring
BGM220 Bluetooth Suite Summary
【text】
Silicon Labs continues to improve our product line, the newly launched BGM220 Bluetooth module wireless entry suite continues the characteristics of Bluetooth wireless connection, ultra low power, security Internet of Things, while providing users with two new products in the product form Select, ultra-compact SIP Bluetooth module and PCB Bluetooth module.
[BGM220 Bluetooth Suite Hardware Introduction]
BGM220 Bluetooth Module Wireless Getting Started Kit uses a color cardboard box, with a highly identified small wall tiger pattern, you can recognize the product of Silicon Labs.
The upper and lower layers of the package, the upper layer is the three core board of this kit:
1 BRD4001A Wireless Getting Started Site Motherboard (Maximum Circuit Board)
1 BRD4310A BGM220S Wireless Gecko Module Radio Board (Left Left Corner Small Circuit Board)
1 BRD4311A BGM220P Wireless Gecko Module Radio Board (Right Corner Small Circuit Board)
The lower layer of the box is some accessories, which is convenient for developers to debug usage.
1 BRD8010A debug adapter board
1 USB A to Mini-B cable
1x 10 pin flat cable for debugging adapter
The core of the BGM220S board is based on the SIP package module. The package size is only 6X6 mm, which is one of the smallest Bluetooth SIP modules in the world. It provides an ultra-compact, low cost, long battery life SIP module, for super Small products add a complete Bluetooth connection capability.
The core of the BGM220P board is a slightly large PCB module, which is optimized for wireless performance and has a better link budget, which can override a larger range.
The BGM220 module wireless entry suite (WSTK) is a superior starting point that is familiar with BGM220P and BGM220S Bluetooth low power modules. This kit contains two radios: 1X SLWRB4311A (BGM220P) and 1X SLWRB4310A (BGM220S) for BGM220 modules. The wireless entry suite motherboard contains a board J-Link debugger with a packet tracking interface and a virtual COM port, which can realize application development and debugging by the connection radio plate and external hardware. The motherboard also includes sensors and peripherals that can easily display certain features in the BGM220. This wireless entry suite provides the necessary tools for developing high capacity, battery-powered Bluetooth low-power IOT products.
[BGM220 Bluetooth Suite SIP Module]
The core of the BGM220SIP module board is a 6.0 x 6.0 x 1.1mm size SIP package module BGM220SC12WGA.
BGM220SC12WGA is one of the wireless modules of EFR32BG22 series 2, including 38.4 MHz ARM Cortex-M33 core, which provides excellent processing power, this module with 352 kB flash memory, 32 kB of RAM, and 6.0 x 6.0 x 1.1mm SIP Package. With the maximum power output of up to 0 DBM and the excellent reception sensitivity of -98.6 DBM, BGM220SC12WGA provides powerful RF links to achieve reliable communication and industry-leading energy efficiency in low-power blue data transmission low-power node applications. At the same time, its integrated security features provide fast encryption, safe start loading, and debug access control. BGM220SC12WGA has been certified around the world, providing support by industry-proven powerful software and advanced development tools, is a full-scale solution that can easily add Bluetooth connection to any IoT design.
BGM220SC12WGA supports Bluetooth 5.2 protocol stack, supports low-power blue tooth, does not support Bluetooth Mesh network, wide temperature range -40 to 85 degrees Celsius.
The BGM220S module integrates a power-friendly MCU / EFR32BG22 SMS (SOC), a decoupling capacitor resistor, a 38.4 MHz crystal, a radio frequency matching circuit, and an integrated antenna.
The chip integration is relatively high, so the chip peripheral circuit is extremely simple in the reference design circuit. Whether it is used as a separate SOC, it is also used as a Bluetooth wireless network chip with MCU, and the peripheral circuit is very simple.
BGM220S Module Radio Circuit Board (BRD4310A) Peripheral Circuit has only one serial flash chip (actual application is not required) and an optional LF Crystal and RF selection circuit.
BGM220SSIP Module Circuit Board benefits from the BGM220SIP module super compact volume, high integration, extremely simple circuit, can achieve Bluetooth connections in a small space, so that mini electronic products increase Bluetooth connection function.
BGM220SSIP module core chip adopts SIP package, high integration, extremely simple external circuit, realizing low cost, simplifying user design threshold, 6x6mm ultra-compact space, bring Bluetooth connection for ultra-small products, this module is based on Silicon Labs EFR32BG22 The chip, inherits the characteristics of EFR32BG22, ultra-low power consumption can realize long-range flight in battery power supply
[BGM220 Bluetooth Suite PCB Module]
The core of the BGM220P PCB module is BGM220PC22HNA
BGM220PC22HNA is another wireless module in EFR32BG22 Series 2, including 38.4MHz ARM Cortex-M33 core, which provides excellent processing power, this module with 512 kB flash memory, 32 kB RAM, and 12.9x15.0x2.2mm size PCB Package. With the highest power output of 8 DBM and the excellent reception sensitivity of -98.9 DBM, BGM220PC22HNA provides powerful RF links to achieve reliability in low-power Bluetooth data transmission, location service, and Bluetooth network network low-power node applications. Communication and industry-leading energy efficiency. At the same time, its integrated security features provide fast encryption, safe start loading, and debug access control. BGM220PC22HNA has been certified around the world, providing support by industry-proven software and advanced development tools, is a full-scale solution that can easily and easily add Bluetooth connection functions to any IoT design.
BGM220PC22HNA supports Bluetooth 5.2 protocol stack, supports search function, support low-power Bluetooth, supports Bluetooth Mesh network, wide temperature range -40 and 105 degrees Celsius.
The BGM220P module integrates a power consumption-friendly MCU / EFR32BG22 SMS, a decoupling capacitance resistor, a 38.4 MHz crystal, a radio frequency matching circuit, and an integrated antenna.
The BGM220P PCB module is more integrated, and the peripheral circuit is extremely simple, and it can be used as a stand-alone SOC or with the MCU as a Bluetooth network chip.
The BGM220P PCB module board (BRD4311A) peripheral circuit only adds a Serial Flash memory chip (the actual application is not required).
[BGM220 Bluetooth Suite Software Development Environment]
The development software of the BGM220 Bluetooth kit is Simplicity Studio V5, which can be used in three platforms in Windows Mac Linux, which is also the development software that Silicon Labs has been developing software.
SIMPLICITY STUDIO V5 is installed normally and loads various components:
SIMPLICITY STUDIO V5 Software Interface: Left List Display Development Kit, right display suite quickly use manual, project routine, document, compatible toolset:
The BGM220 Bluetooth Site SIP module is inserted into the computer and the development software displays the BGM220SC12WGA wireless module board.
Development kit connection, debug mode, firmware version, selectable SDKS, Quick User Guide:
Motherboard related document list, with motherboard schematic, assembly map, etc.
BGM220S Bluetooth Suite SIP Module Circuit Board Related Document List, Reference Manual, Schematic, BOM file, mount diagram:
BGM220S Bluetooth Suite SIP chip related documentation, Bluetooth SDK use guide, Bluetooth SDK V2 migrated to V3 documentation, module receipt manual, etc .;
BGM220S Bluetooth kit project routine and Demo, there are about 23, and there are 3 complete DEMOs, 20 other items:
The BGM220S Bluetooth kit, such as Bluetooth NCP Command to send commands to the Bluetooth wireless module, Migrate Projects migrate the SIMPLICITY V4 project to V5 version, Flash Programmer burning download tool, Energy Profiler power consumption analysis tool Wait:
[BGM220 Bluetooth Suite Routine Demo]
1, thermometer: BGM220P Bluetooth module, send the temperature sensor information on the motherboard to the phone via Bluetooth; mobile phone installation APP client, connect the BGM220P Bluetooth module by Bluetooth, can see the real-time temperature information.
2, IBEACON ranging: BGM220P Bluetooth module burned IBEACON firmware; mobile installed App clients, scanned to the BGM220P Bluetooth module via Bluetooth, can view the RSSI data of the module, or view the distance of the module relative to the phone.
3, Bluetooth network chip DEMO: This DEMO only uses the BGM220P Bluetooth module as a Bluetooth network chip, the computer acts as a Host MCU, sending instructions to the BGM220P Bluetooth module, you can use this module to search near Bluetooth devices.
First connect the BGM220P Bluetooth kit.
The computer sends an instruction to the BGM220P Bluetooth module, you can search for many Bluetooth devices nearby:
[BGM220 Bluetooth Suite power consumption real-time monitoring]
Simplicity Studio V5 Integrates Energy Profiler tools, this tool can dynamically monitor the power consumption of modules in real time:
Power consumption curve can be enlarged, view module instantaneous power details:
[BGM220 Bluetooth Suite Summary]
BGM220 Bluetooth Module Wireless Getting Started Silicon Labs EFR32BG22 Bluetooth Wireless Chip, Continuing and Inheriting Silicon Labs leads in wireless low-power Bluetooth chips and various hardware and software supporting resources, while providing two new products The Bluetooth module in the form of the SIP package and the Bluetooth module in the form of PCB packages.
The SIP package module provides a possibility that the Bluetooth connection capability of ultra-small electronic products is provided with a larger volume, and the PCB package is in a larger volume of wireless performance and coverage.
Both product forms have extremely high integration, crystal oscillator, radio frequency matching circuit, and antenna complete integration, which greatly reduces the difficulty of peripheral circuits, enhances the reliability of the product's stable line, reducing hardware engineer design, and reducing product embedding The Bluetooth module is difficult to make Silicon Labs's Bluetooth products are more easier to land.
A new attempt in the form of a product, actually accelerating a big step on the market.
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